Interfacial Crack Growth-Based Fatigue Lifetime Prediction of Thermoelectric Modules under Thermal Cycling

Abstract

As a result of the complexity and difficulty of the lifetime assessment of the thermoelectric (TE) module, the related research is still immature. In this work, to predict the lifetime of the Bi 2 Te 3 -based TE module from the perspective of cyclic thermal stress leading to interface cracking, the viscoplastic behavior of the solder layer is first described by the Anand material ontology model, and then the sprouting and expansion of interface cracking of the module are simulated by combining the Darveaux model and the viscoplastic dissipation energy accumulated during the thermal stress cyclic loading. After that, the complete lifetime prediction model of the TE module is established on the basis of the thermal cycling experiments and the finite element simulation calculation data, which can simply and efficiently predict the cycle number of the module resistance rise and its rise rate. The prediction deviations are 6.1 and 6.7%, respectively, verifying the feasibility of the model. The work in this paper can provide a reference for the life evaluation of TE modules.

Soldering Pressure Effect on Lifetime of Thermoelectric Modules under Thermal Cycling

“…For the case of the module assembled at 50 N pressure, the resistance initially remains constant and then starts to increase at a fixed slope after 350 cycles. This behavior was explained in our previous work, attributing the resistance growth to the generation and expansion of interfacial cracks . Before the microcracks are formed, the module resistance remains constant.…”