Detachable adhesives are considered to be an essential
strategy
to realize reuse and recycle of the bonded components, but it is a
great challenge to fabricate a detachable adhesive with ultra-high
bonding strength. In this study, electrically detachable ionic conductive
epoxy adhesives (IEPs) are prepared through introduction of poly(ethylene
glycol) (PEG) and 1-butyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide
([BMIM]TFSI) into epoxy. It is found that an initial bonding strength
of more than 20 MPa can be realized via adjusting the PEG molecular
weight due to the stronger crystallization tendency of PEG with a
higher molecular weight that shows remarkable reinforcement and strengthening
effect. In spite of the ultra-strong bonding of the IEPs, they can
be completely and automatically detached by applying 60 V DC voltage
within 1 min. The electrically detaching mechanisms of IEPs are further
studied and it is confirmed that the electrically detaching behavior
is dependent on the electrodecomposition of ionic liquids; thus, the
electrodecomposition mechanism of [BMIM]TFSI and the impacts on bonding
substrates are presented. It is believed that this work provides an
effective strategy for developing electrically detachable adhesives
with ultra-high initial bonding strength.