2016
DOI: 10.1016/j.compstruct.2016.07.075
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Interfacial failure modelling of diamond bits made of particulate composites

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Cited by 13 publications
(6 citation statements)
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“…where P y is the tensile yield stress for the matrix material; R is the radius of the plastic zone; K m , µ m and α m are the bulk modulus, shear modulus and coefficient of thermal expansion of the matrix respectively; K 1 and α 1 are the bulk modulus and coefficient of thermal expansion of the diamond, respectively; and ∆T is the temperature decrease during cooling. In recent years, numerical computation methods have been widely used to study diamond retention in the matrix, and have been utilized to evaluate thermal residual stresses [92][93][94][95], local plastic deformation [13,96] and interfacial pullout behavior [4,11]. Cracks are easily generated at the interface due to large thermal stresses; a decrease in thermal residual stress is beneficial to diamond retention strength [29].…”
Section: Mechanical Calculation Methodsmentioning
confidence: 99%
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“…where P y is the tensile yield stress for the matrix material; R is the radius of the plastic zone; K m , µ m and α m are the bulk modulus, shear modulus and coefficient of thermal expansion of the matrix respectively; K 1 and α 1 are the bulk modulus and coefficient of thermal expansion of the diamond, respectively; and ∆T is the temperature decrease during cooling. In recent years, numerical computation methods have been widely used to study diamond retention in the matrix, and have been utilized to evaluate thermal residual stresses [92][93][94][95], local plastic deformation [13,96] and interfacial pullout behavior [4,11]. Cracks are easily generated at the interface due to large thermal stresses; a decrease in thermal residual stress is beneficial to diamond retention strength [29].…”
Section: Mechanical Calculation Methodsmentioning
confidence: 99%
“…The pressure and the elastic energy of a diamond particle and the strain of the deformed matrix around the particle (radius of plastic zone) are good indicators of the efficiency of mechanical retention [97][98][99][100]. Diamond retention is estimated by determining the critical force required to pull out the diamond particle from the matrix [4,11,101].…”
Section: Mechanical Calculation Methodsmentioning
confidence: 99%
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“…The difference in wear forms between P2 and P3 can be explained by the difference in the force required to pull out the entire particle F p . F p can be estimated roughly by F p = τA, 49 where τ is the interfacial strength and A is the total interfacial area of buried portion. Based on SEM images after FIB cutting, it is possible to make a rough estimate of A which is about 5.6 μm 2 for P2 and 1.5 μm 2 for P3 (Figure 5e).…”
Section: Friction?mentioning
confidence: 99%
“…As a result of this low bond strength, diamond grits typically fracture and/or flake off the Ni layer, which accelerates wear between the surfaces subject to tribological contact. Furthermore, the thermal expansion mismatch between diamond and the self-sharpening metal matrix must be minimized, since the high residual compressive stresses accumulated at the interface, which are responsible for the mechanical retention capacity, might lead to the early dislodging of the embedded diamond particles [14]. There are many different alternative techniques capable of achieving a better level of metal-to-diamond bonding to overcome these problems nowadays, such as: the molten salt method [15], chemical vapor deposition [16], plasma spray [17], spark plasma sintering [18], hot isostatic pressing [19], and laser brazing methods [20], which have been employed in the manufacture of different metal-bonded diamond abrasive tools with different results.…”
Section: Introductionmentioning
confidence: 99%