Interfacial fracture toughness test methodology for flip chip underfill encapsulant

Pang, H.L.J.; Zhang, X.R.; Lim, C.H.; Shi, Xu; Wang, Z.P.

doi:10.1109/ectc.2002.1008327

Cited by 3 publications

(1 citation statement)

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“…The failure modes depending on the type of load applied to the crack and the in the solder joints can be adhesive (interface failures between stress fields surrounding the crack tip. solder and metallization) or cohesive (failure through the Frtefatr ehnc prah adihts solder joint) in nature [1,2]. Bulk solders have been used for .…”

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confidence: 99%

Fracture Toughness Assessment of a Solder Joint using Double Cantilever Beam Specimens

Adeline

Lima

Yantaraa

et al. 2008

2008 10th Electronics Packaging Technology Conference

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properties like yield strength, modulus from stress-strain Conventional assessment of solder joint reliability uses either curve, its creep behaviour as a function of tensile loading ball shear test or solder ball pull test. The test results are speeds, Arrhenius dependency and etc. However, the reported in terms of materials strength in either shear or tensile properties of bulk solder specimens may not be reflective of mode, and the strength values are size-dependent. Therefore solder joints. Therefore, testing ofjoints would ensure that the these test results are largely useful only for qualitative effects of microstructural changes have been accounted for [4] comparison and qualification of the products. In the current and the development of interface crack would be closely effort, we aim at developing an assessment scheme for solder related to the actual product [5].

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confidence: 99%