Interfacial metallurgical reaction between small flip-chip Sn/Au bumps and thin Au/TiW metallization under multiple reflow

Yu, D.Q.; Oppermann, Hermann; Kleff, J.; Hütter, Matthias

doi:10.1016/j.scriptamat.2007.11.020

Cited by 11 publications

(6 citation statements)

References 7 publications

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“…The Au on the substrates was almost fully consumed. For the combinations with SAC solder and Ni/Au on the substrate (7, 9, 11), most of the joint consisted of Sn, with regions of grains containing Ag, Au and Sn, possibly a variation of (Ag,Au) 3 Sn. An example from combination 7 is shown in Figure 2 (right), and the appearance of the cross sections was similar for those three combinations.…”

Section: Cross Sections and Imc As-bonded And After Thermal Agingmentioning

confidence: 99%

“…With respect to soldering, dewetting is a phenomenon where a droplet formation of the solder takes place on the surface to which bonding should occur. Dewetting of eutectic SnPb and AuSn solder from TiW once the wetting layer has been consumed, is a well-known problem [2] and void formation due to partial dewetting can occur [3]. The problem can be mitigated with layers of Cu and/or Ni on top of the TiW adhesion layer [4].…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

MEMS and Thermal Management

2016

Advancing Microelectronics Magazine

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Section: Cross Sections and Imc As-bonded And After Thermal Agingmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

MEMS and Thermal Management

2016

Advancing Microelectronics Magazine

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“…Both the brittle AuSn 4 phase and the weak interface between the Au-Sn IMCs and the solder matrix will lead to significant strength reduction and embrittlement of the gold soldered joint [20][21][22][23][24][25][26]. The thickness of Au layer, the soldering temperature and time, temperature and time of solid-state thermal cycling and aging have the important effect on the embrittlement [27][28][29][30][31][32][33]. As the aging temperature rises or the time increases, the dissolution rate of Au into Sn-based solder will increase largely.…”

Section: Introductionmentioning

confidence: 99%

Influence of Thermal Aging on Microstructure and Property of Gold Alloy Joint Soldered by Sn-based Solder

et al. 2019

MATEC Web Conf.

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As an undisputed material of choice to guarantee reliability in a broad range of high performance and safety-critical applications in the electrical contacts and connectors, AuAgCu alloy was soldered with Ag-plated Cu wire using Sn-based solder. To clarify the embrittlement and strength reduction of the gold soldered joint, the microstructure and its influence on the macroand micro-mechanical properties of the soldered joint under various thermal aging conditions were studied. The result indicated that, taking the mechanical property consideration alone, Sn-based solder could be used to join AuAgCu alloy. Different from the embrittlement and strength reduction of the soldered joint of pure gold, although the brittle fracture features appeared in mechanical test of the soldered joints, the shear strength of soldered joint after thermal aging at 125 °C almost did not decrease in comparison with that before thermal aging. Nevertheless, too high temperature and long time still had bad influence on mechanical properties. Otherwise, thermal aging had a large effect on the IMCs layer, as aging temperature elevated and aging time increased, IMCs layer became thicker, more complex components and multiply-sublayers structure with different microhardness. The study provides a fundamental understanding for gold alloy soldering.

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“…Hou [2] et al analyzed pressure, the cooling rate gold-plated layer and the peak temperature influence on AuGe eutectic welding, draw a greater influence on the cooling rate on the shear strength of welds. The paper [3] studied the effect of the size of the solder joint especially the height on the solders reliability under many times reflow soldering process, the conclusion is that the smaller size solder have the better performance. from liquid to solid, and not through plastic deformation.…”

Section: Introductionmentioning

confidence: 99%

Simulation Research on Solder Joint Residual Strain Energy of Au80/Sn20 Eutectic Soldering GaAs Chip

Liu¹,

Wu²

2015

Proceedings of the First International Conference on Information Sciences, Machinery, Materials and Energy

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After Au80/Sn20 eutectic soldering GaAs chips process, Au80/Sn20 solder joints will have large residual stress and strain because of materials' coefficient of thermal expansion (CTE) mismatch. Large strain deformation will lead to the chip position migration. On the other hand too much stress can make the interface micro cracks and affect the quality and long-term reliability of Au80/Sn20 solder joints. Choosing welding pressure, cooling rate and the thickness of the precast solder pieces as the key process parameters, and designing the L16 (43) orthogonal test table. According to the Au80 / Sn20 eutectic soldering real environment, using finite element analysis software ANSYS to establish the simulation model of Au80 / Sn20 eutectic soldering process. After simulation analysis, it got the maximum residual stress and the strain energy of the solder joint. The primary of the factors is cooling rate, the secondary of the factors is the thickness of the precast solder pieces and pressure is the last by range analysis. The achieved process parameters and forming residual stress and the strain energy of the relationship between solder joints can provide reference and guidance for practical production. Eutectic welding processAu80/Sn20 eutectic welding technology is a low melting point technology. Under the temperature (280℃), solder Au80/Sn20 appears eutectic fusion phenomenon, the alloy directly International Conference on Information Sciences, Machinery, Materials and Energy (ICISMME 2015)

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Interfacial metallurgical reaction between small flip-chip Sn/Au bumps and thin Au/TiW metallization under multiple reflow

Cited by 11 publications

References 7 publications

MEMS and Thermal Management

MEMS and Thermal Management

Influence of Thermal Aging on Microstructure and Property of Gold Alloy Joint Soldered by Sn-based Solder

Simulation Research on Solder Joint Residual Strain Energy of Au80/Sn20 Eutectic Soldering GaAs Chip

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