Interfacial microstructure and performance of brazed diamond grits with Ni–Cr–P alloy

Wang, C.Y.; Zhou, Yumei; Zhang, F.L.; Xu, Zheng

doi:10.1016/j.jallcom.2008.09.134

Cited by 61 publications

(26 citation statements)

References 14 publications

(15 reference statements)

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“…The knowledge on the growth behaviors of TiC is essential for the understanding of failure mechanism of brazed diamond grits, and hence the optimization of brazing process. However, existing research focus more on the characterization of the interface products formed between diamond grits and commercial Ti-containing filler alloys at a certain brazing temperature [9][10][11][12][13], or the technology development of brazing process [14,15]. To the best knowledge of authors, there is little information available regarding the growth behavior of interfacial TiC at variable brazing temperatures, especially at relatively low brazing temperatures [16].…”

Section: Introductionmentioning

confidence: 99%

Formation of TiC via interface reaction between diamond grits and Sn-Ti alloys at relatively low temperatures

Liao

Wang

et al. 2017

International Journal of Refractory Metals and Hard Materials

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In this paper, interfacial reaction between diamond grit and Sn-6Ti alloy was systematically studied at brazing temperatures from 600 to 1030 o C. A thin and uniform layer of scallop-like nano-sized TiC grains was formed after brazing for 30 minutes at 600 o C, and interfacial TiC grains subsequently coarsened as brazing temperature increased to 740 and 880 o C. Strip-like columnar TiC grains in a bilayer structure was further grown as brazing temperature increased to 930 o C. After brazing at 1030 o C, a dense layer of columnar TiC grains were formed. Based on the TEM micrographs of interfacial TiC, the formation and evolution of the growth morphologies of interfacial TiC was believed to be controlled by the diffusion of C flux from diamond grits, which is dependent on the brazing temperatures.

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Section: Introductionmentioning

confidence: 99%

Formation of TiC via interface reaction between diamond grits and Sn-Ti alloys at relatively low temperatures

Liao

Wang

et al. 2017

International Journal of Refractory Metals and Hard Materials

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“…Wang et al [21] have studied the microstructure and corresponding properties of the brazed diamond grit over a steel substrate using Ni-Cr-P filler metal, Figures 7 and 8. Within the interface domain of diamond and the brazing alloy zones, A and B in Figure 7a,b, (marked with the white arrows), were selected for a study.…”

Section: High Temperature (≥900 °C) Pbfmsmentioning

confidence: 99%

Research and Development of Powder Brazing Filler Metals for Diamond Tools: A Review

Long

Sekulić

2018

Metals

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Powder brazing filler metals (PBFMs) feature a number of comparative advantages. Among others, these include a low energy consumption, an accurate dosage, a good brazeability, a short production time, and a high production efficiency. These filler metals have been used in the aerospace, automobile, and electric appliances industries. The PBFMs are especially suitable for diamond tools bonding, which involves complex workpiece shapes and requires accurate dosage. The recent research of PBFMs for diamond tools is reviewed in this paper. The current applications are discussed. The CuSnTi and Ni-Cr-based PBFMs have been the two commonly used monolayer PBFMs. Thus, the bonding mechanism at the interface between both the monolayer PBFMs and a diamond tool are summarized first. The ways to improve the performance of the monolayer PBFMs for diamond tools are analyzed. Next, a research of PBFMs for impregnated diamond tools is reviewed. The technical problems that urgently need solutions are discussed. Finally, the challenges and opportunities involved with the PBFMs for diamond tools research and development are summarized, and corresponding prospects are suggested.At present, extensive studies have been conducted on PBFMs. For example, Ivanov et al. [6] studied the solid-phase synthesis of a PBFM for the titanium alloy vacuum brazing. He et al. [7] considered the influence of a powder containing 50% TiH 2 and 50% Ni (used for brazing Ti-Al intermetallic compounds) on the joint structure and mechanical properties. Liu et al. [8] explored the structure and properties of the zirconia and stainless steel joints obtained with Ag-Cu brazing filler metal and TiH 2 PBFM under normal pressure (1.01 × 10 5 Pa). Zhang and Tu [9] investigated the structure and properties of the lead-free solder containing micro/nano powder. Ti-Al intermetallic compounds are extensively applied in the aerospace industry, while the lead-free solder has been widely used in the electronics industry. Ag-Cu brazing filler metal and TiH 2 powder are broadly applied in the ceramics industry. However, the mentioned applications in the aerospace, ceramics, and electronics industries have not been the exclusive application fields of PBFMs.The aforementioned PBFMs cannot necessarily be used in more demanding environments, such as high temperature, high pressure, and heavy loads. The PBFMs for diamond tools occupy a considerable proportion of manufacturing. They has been further implemented in novel application areas, e.g., transportation and mining machineries.In this paper, we review the recent research of PBFMs for diamond tools. The current application status is discussed. The interface bonding mechanism of commonly used monolayer PBFMs for diamond tools is also addressed. Furthermore, the ways to improve the performance of the PBFMs for diamond tools is discussed. The studies of PBFMs for impregnated diamond tools are reviewed. Technical problems that urgently need solutions are discussed. Finally, the limits of applications and prospects of powder brazin...

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“…Perry et al [35] reported that after deposition, the XPS sputter depth profile of the near-surface region of the Cu substrate contains carbon species with a thickness of dozens of nanometer. The diffusion of Cu into diamond film will obtain the same bonding performance of brazed diamond grits with Ni-Cr-P alloy [36]. Actually, even without any chemical bonding, the mechanical interaction existed in the interface of diamond and pure Cu substrate is stronger than 1800 N/cm 2 [37].…”

Section: Electrochemical Measurements Of Bddmementioning

confidence: 99%

Effects of copper interlayer on deposition and flexibility improvement of diamond microelectrode

Long

Wang

Zhang

et al. 2014

Surface and Coatings Technology

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Interfacial microstructure and performance of brazed diamond grits with Ni–Cr–P alloy

Cited by 61 publications

References 14 publications

Formation of TiC via interface reaction between diamond grits and Sn-Ti alloys at relatively low temperatures

Formation of TiC via interface reaction between diamond grits and Sn-Ti alloys at relatively low temperatures

Research and Development of Powder Brazing Filler Metals for Diamond Tools: A Review

Effects of copper interlayer on deposition and flexibility improvement of diamond microelectrode

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