Interfacial microstructure of CuCr/1Cr18Ni9Ti bi-metal materials and its effect on bonding strength

Abstract

The CuCr/1Cr18Ni9Ti bi-metal materials were prepared by the solid-liquid bonding method. The microstructures, mechanical properties and formation mechanism of the bonding interface were studied. The results show that there exists a serrated transition layer with a certain width at the interface of CuCr/1Cr18Ni9Ti bi-metal materials, and the transition layer consists of Fe-based and Cu-based solid solutions. The elastic modulus and hardness reach the maximum values at the interface closing to the 1Cr18Ni9Ti zone. The bonding temperature has a significant effect on the width and morphology of the transition layer. The interfacial bonding strength is at least 30% higher than that of the CuCr alloy, and the tensile fracture occurs at the side of the CuCr alloy rather than at the bonding interface. solid-liquid bonding method, CuCr/1Cr18Ni9Ti bi-metal material, interface, microstructure, bonding strength Citation:Zhang Q, Liang S H, Zou J T, et al. Interfacial microstructure of CuCr/1Cr18Ni9Ti bi-metal materials and its effect on bonding strength.