Interfacial Phenomena between Liquid Ga-Based Alloys and Ni Substrate

Gancarz, Tomasz; Berent, Katarzyna; Schell, Norbert; Chulist, R.

doi:10.1007/s11664-019-07356-7

Cited by 8 publications

(4 citation statements)

References 35 publications

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“…1c), there was no reactively formed interfacial phase. The sputtered Cu or Ni layer could react with eutectic Ga-Sn-Zn alloy as shown in the previous study (Ref 8,10). However, such a reaction, means formation of IMCs layer at the interface should help to protect the graphene layer from mechanical wear from liquid eutectic Ga-Sn-Zn.…”

Section: Resultsmentioning

confidence: 78%

The Interfacial Phenomena Between Graphene on Cu Substrate Covered by Ni, Cu, or W Layer, with Liquid Ga-Sn-Zn Alloy

Gancarz

Ozga

Pstruś

et al. 2023

J. of Materi Eng and Perform

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To obtain better parameters of wetting and interfacial properties, the Cu substrate was covered by graphene. The first experiment showed that the liquid metal mechanically destroys the graphene layer. Therefore, the Ni, Cu, or W layer was sputtered to secure the graphene. The obtained graphene was examined by micro-Raman spectrometry. The thickness of the Cu, Ni, or W layer was ~ 25 nm, compared to previous work, where the thickness of the Ni-W electrochemically deposited layer varied from 8-10 μm. To observe changes at the interface, the experiments were performed with Ga-Sn-Zn eutectic alloy using the sessile drop method at temperatures of 100, 150, and 250 °C long-time contact of 1, 10, or 30 days. Atomic force microscopy was used to show the topology of obtained samples. The microstructure observation of the cross-sectioned samples was made by scanning electron microscopy combined with energy dispersive x-ray spectroscopy. The x-ray diffraction was conducted to identify occurring phases at the interface from the Cu-Ga system. The investigation showed that such a very thin Ni, Cu, or W layer is not sufficient to protect the Cu substrate from a reaction with liquid metals such as eutectic Ga-Sn-Zn, which can be used in cooling systems. The performed XRD analysis and microstructure observations show the occurring CuGa2 phase at the interface and dissolution of the Cu substrate in molten alloy with increasing temperature and time. The interfacial CuGa2 phase grows very slowly at annealing temperatures below 150 °C for the graphene/Ni and graphene/W coatings. Therefore, these coatings can be used to protect a copper substrate in cooling electronic devices.

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Section: Resultsmentioning

confidence: 78%

The Interfacial Phenomena Between Graphene on Cu Substrate Covered by Ni, Cu, or W Layer, with Liquid Ga-Sn-Zn Alloy

Gancarz

Ozga

Pstruś

et al. 2023

J. of Materi Eng and Perform

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“…To investigate the growth of Ga–Ni IMC layer at the LM/Ni interface, Gancarz et al 60 performed wetting experiments to analyze the interfacial microstructure between the liquid eutectic Ga–Sn–Zn alloy and Ni substrate. After a certain time, a variety of Ga–Ni compounds appeared at the interface.…”

Section: Wetting Of Gallium-based Liquid Metalsmentioning

confidence: 99%

Interfacial interaction-induced super-wettability of gallium-based liquid metals: a review

Wang,

Xie

2024

J. Mater. Chem. A

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“…[ 13 ] Figure shows the Ga–Ni equilibrium phase diagram with a total of eight possible IMCs at or near room temperature. [ 16 ] The effect of time and temperature and growth of IMC layer was reported between Ga–Sn–Zn alloy and a Ni substrate by Gancarz et al [ 17 ] They studied the microstructure of the IMC as a result of time and temperature when eutectic Ga–Sn–Zn is wetted on a Ni substrate, and show that the dissolution with Ga–Ni is slower than with the Ga–Cu‐based system. They further reported Ga 3 Ni 2 and Ga 7 Ni 3 phases at longer durations.…”

Section: Review Of Gallium‐based Reliability Riskmentioning

confidence: 99%

Field Risk Evaluation of Liquid Metal Interconnects in Microelectronics Applications

Meyyappan,

Murtagian,

Tadayon

et al. 2023

Adv Eng Mater

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Gallium is one of the most desirable, yet less known, interconnects considered in the semiconductor industry. Good electrical conductivity and high stretchability of the liquid metal makes it very attractive for many applications. It allows components to be assembled or disaggregated like Lego blocks without any external forces or energy. The focus of this paper is to shed light on intrinsic reliability degradation mechanisms for components that use liquid metal interconnects. As a starting reference to field reliability risk evaluations, the authors focus on common/controlled use conditions. Environments studied include standard test evaluation procedures like thermal aging (sustained exposure to high temperature over time), thermal cycling, current carrying capability and finally functional product life cycle testing. Studies reveal that the interconnect has very distinct failure mechanisms and unique advantageous/disadvantageous over existing interconnects. Fundamental knowledge gained in this study is expected to help 1) drive future architectures, 2) material/design changes to address any limitations and 3) lastly new qualification methods/standards that account for the unique failure mechanisms.This article is protected by copyright. All rights reserved.

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Interfacial Phenomena between Liquid Ga-Based Alloys and Ni Substrate

Cited by 8 publications

References 35 publications

The Interfacial Phenomena Between Graphene on Cu Substrate Covered by Ni, Cu, or W Layer, with Liquid Ga-Sn-Zn Alloy

The Interfacial Phenomena Between Graphene on Cu Substrate Covered by Ni, Cu, or W Layer, with Liquid Ga-Sn-Zn Alloy

Interfacial interaction-induced super-wettability of gallium-based liquid metals: a review

Field Risk Evaluation of Liquid Metal Interconnects in Microelectronics Applications

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