Interfacial reaction and IMC growth between Bi-containing Sn0.7Cu solders and Cu substrate during soldering and aging

Hu, Xiaowu; Li, Yulong; Min, Zhixian

doi:10.1016/j.jallcom.2013.08.018

Cited by 82 publications

(19 citation statements)

References 18 publications

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“…From the figure, it is confirmed that the growth of interfacial IMC layers follows diffusion control mechanism. In addition, other researchers [14,15] noticed that the interfacial IMC layers in many solder systems follow the diffusion control mechanism.…”

Section: Resultsmentioning

confidence: 99%

Effect of Interval Aging Mode on IMC Growth between Low Ag Content Sn-0.3Ag-0.7Cu-0.5Bi-Ni and Cu Substrate

Qu¹,

Cui²,

Liu³

et al. 2018

Proceedings of the 4th Annual International Conference on Material Engineering and Application (ICMEA 2017)

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Abstract-To simulate the application environment of a number of electronic products, the growth of Sn-0.3Ag-0.7Cu-0.5Bi-Ni/Cu solder joints with low content of Ag was investigated during aging in an interval mode. It shows that the intermetallic compound (IMC) (Cu,Ni) 6 Sn 5 layer becomes thicker with increasing aging time. The growth of IMC (Cu,Ni) 6 Sn 5 layer during aging follows the diffusion control mechanism. Furthermore, it is demonstrated that there is no IMC Cu3Sn layer appear whatever increasing the aging time. It is explained the phenomenon is mainly attribute to the interval aging mode. According to kinetics, the activation energy is not high enough to overcome the energy obstacle due to the interval aging mode and finally the Cu3Sn phase doesn't form. Hence, the reliability of solder joints is improved.

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Section: Resultsmentioning

confidence: 99%

Effect of Interval Aging Mode on IMC Growth between Low Ag Content Sn-0.3Ag-0.7Cu-0.5Bi-Ni and Cu Substrate

Qu¹,

Cui²,

Liu³

et al. 2018

Proceedings of the 4th Annual International Conference on Material Engineering and Application (ICMEA 2017)

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“…However, in spite of the candidates of Sn-Pb alloy, there are still quite a few shortcomings in binary alloys, for instance, poor wettability, poor mechanical properties, high melting point, high cost, excessive growth of interfacial compounds, easy oxidation as compared to Sn-Pb eutectic alloys. Accordingly, scholars keep on exploiting tin-based alloys, for example, Sn-Cu-Bi, Sn-Ag-Zn, Sn-Ag-Cu alloy etc [2,3] .…”

Section: However As European Union Waste Of Electrical and Electronimentioning

confidence: 99%

Growth behavior of IMCs layer between Sn-3.0Ag-0.5Cu solder and Cu substrate during aging

Qu¹,

Cao²,

Cui³

et al. 2018

Proceedings of the 2018 3rd International Conference on Automation, Mechanical Control and Computational Engineering (AMCCE 201

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Growth behavior of intermetallic compounds (IMCs) layer between Sn-3.0Ag-0.5Cu solder and Cu substrate were studied during aging at 150 ℃ for 1 day, 3 days, 6 days, 8 days and 10 days, respectively. Results shows that the IMCs layer is scallop shape at aging stage, and the aspect ratio of scallop shape decreases with time increasing. Moreover, the IMCs layer grows thicker with extended aging time. Furthermore, the IMCs layer grows linearly with square root of aging time, and the growth kinetic equation of Sn-3.0Ag-0.5Cu/Cu solder joints is obtained by linear fit, which is X = 1.94 +1.95t1/2. Finally, the diffusion coefficient D is verified as 3.8025μm2/d.

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“…6d, 10c, d. Commonly, Bi segregation at the Cu 3 Sn/Cu interface always occurs in the Bi-containing solder/Cu couples [20][21][22]. Unfortunately, the Bi segregation dramatically deteriorates the mechanical properties of solder joints [23,24].…”

Section: Growth Of Cu-sn Imc During Isothermal Solidstate Agingmentioning

confidence: 99%

A study on the interfacial reaction of Sn58Bi/Cu soldered joints under various cooling and aging conditions

Huang

et al. 2015

J Mater Sci: Mater Electron

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As one of the important factors affecting the quality of soldered joints, the interfacial intermetallic compound (IMC) formed at the solder/substrate interface is of increasing concern to researchers. Thus, the growth behavior of interfacial IMC in Sn58Bi/Cu solder joints was investigated as different cooling methods-quenched water, cooling in air, and cooling in a furnace during reflowing were used. In this work, the effect of cooling rate on interfacial IMC growth is studied in Sn58Bi/Cu system. Morphology and growth kinetics of the interfacial Cu-Sn IMC under various cooling rates were studied. It was found that only scallop-like Cu 6 Sn 5 IMC layer was observed between solder and Cu substrate in cases of water cooling and air cooling, while bi-layer composed of scallop-like Cu 6 Sn 5 and planar Cu 3 Sn was detected under furnace cooling due to sufficient reaction time to form Cu 3 Sn between Cu 6 Sn 5 IMC and Cu substrate which resulted from slow cooling rate. Samples with different reflow cooling rate were further thermal aged at 373 and 393 K, respectively. The results showed that the morphology of interfacial Cu-Sn IMC layer would transform from scallop-like to planar-like with increasing aging time, and the thickness of IMC increased linearly with square root of aging time. The growth constants of interfacial IMC layer were obtained and compared for different cooling rates and aging temperatures, indicating that the IMC layer thickness increased faster in samples under slow cooling rate than the fast cooling ones under the same aging condition, and higher aging temperature could result in faster growth of IMC layer. The interfacial Cu 6 Sn 5 grains gradually transformed to facet prismatic shape as the cooling rate decreased, and the grain size increased dramatically as the samples were cooled in furnace, comparing with that of samples cooled in water and air.

show abstract

Interfacial reaction and IMC growth between Bi-containing Sn0.7Cu solders and Cu substrate during soldering and aging

Cited by 82 publications

References 18 publications

Effect of Interval Aging Mode on IMC Growth between Low Ag Content Sn-0.3Ag-0.7Cu-0.5Bi-Ni and Cu Substrate

Effect of Interval Aging Mode on IMC Growth between Low Ag Content Sn-0.3Ag-0.7Cu-0.5Bi-Ni and Cu Substrate

Growth behavior of IMCs layer between Sn-3.0Ag-0.5Cu solder and Cu substrate during aging

A study on the interfacial reaction of Sn58Bi/Cu soldered joints under various cooling and aging conditions

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