Interfacial reaction and mechanical properties between low melting temperature Sn–58Bi solder and various surface finishes during reflow reactions

Lee, Sang‐Min; Yoon, Jeong‐Won; Jung, Seung‐Boo

doi:10.1007/s10854-014-2589-4

Cited by 13 publications

(2 citation statements)

References 25 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…12c1, c2. It is similar to the morphology evolution of interfacial IMCs formed at the Sn-58Bi/OSP-finished Cu interface for different reflow times developed by Lee et al [29], in which the shape of IMCs changed from a scallop-like to a facet-like as the reflow time increased.…”

Section: Growth Of Cu-sn Imc During Isothermal Solidstate Agingsupporting

confidence: 87%

A study on the interfacial reaction of Sn58Bi/Cu soldered joints under various cooling and aging conditions

Huang

et al. 2015

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

As one of the important factors affecting the quality of soldered joints, the interfacial intermetallic compound (IMC) formed at the solder/substrate interface is of increasing concern to researchers. Thus, the growth behavior of interfacial IMC in Sn58Bi/Cu solder joints was investigated as different cooling methods-quenched water, cooling in air, and cooling in a furnace during reflowing were used. In this work, the effect of cooling rate on interfacial IMC growth is studied in Sn58Bi/Cu system. Morphology and growth kinetics of the interfacial Cu-Sn IMC under various cooling rates were studied. It was found that only scallop-like Cu 6 Sn 5 IMC layer was observed between solder and Cu substrate in cases of water cooling and air cooling, while bi-layer composed of scallop-like Cu 6 Sn 5 and planar Cu 3 Sn was detected under furnace cooling due to sufficient reaction time to form Cu 3 Sn between Cu 6 Sn 5 IMC and Cu substrate which resulted from slow cooling rate. Samples with different reflow cooling rate were further thermal aged at 373 and 393 K, respectively. The results showed that the morphology of interfacial Cu-Sn IMC layer would transform from scallop-like to planar-like with increasing aging time, and the thickness of IMC increased linearly with square root of aging time. The growth constants of interfacial IMC layer were obtained and compared for different cooling rates and aging temperatures, indicating that the IMC layer thickness increased faster in samples under slow cooling rate than the fast cooling ones under the same aging condition, and higher aging temperature could result in faster growth of IMC layer. The interfacial Cu 6 Sn 5 grains gradually transformed to facet prismatic shape as the cooling rate decreased, and the grain size increased dramatically as the samples were cooled in furnace, comparing with that of samples cooled in water and air.

show abstract

Section: Growth Of Cu-sn Imc During Isothermal Solidstate Agingsupporting

confidence: 87%

A study on the interfacial reaction of Sn58Bi/Cu soldered joints under various cooling and aging conditions

Huang

et al. 2015

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

show abstract

“…Currently, the non-eutectic Sn-Bi solder for interfacial reaction only includes Sn-5Bi [ 11 ] and Sn-10Bi [ 12 , 13 ], where Cu 6 Sn 5 and Cu 3 Sn IMCs were formed at the interface and the growth kinetics of Cu-Sn IMC layers were studied under the thermal aging, while most research was focused on Sn-58Bi eutectic solder. Lee et al [ 14 ] investigated the interfacial reaction products of Sn-58Bi solder on Cu and electroless nickel-immersion gold (ENIG), and the corresponding IMC were Cu 6 Sn 5 and Ni 3 Sn 4 , respectively. Hu et al [ 15 ] studied the growth kinetics of Cu-Sn IMC between molten Sn-58Bi and Cu, and found that the IMC thickness followed the linear growth on soldering temperature.…”

Section: Introductionmentioning

confidence: 99%

Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints

et al. 2017

View full text Add to dashboard Cite

Sn-Bi solder with different Bi content can realize a low-to-medium-to-high soldering process. To obtain the effect of Bi content in Sn-Bi solder on the microstructure of solder, interfacial behaviors in solder joints with Cu and the joints strength, five Sn-Bi solders including Sn-5Bi and Sn-15Bi solid solution, Sn-30Bi and Sn-45Bi hypoeutectic and Sn-58Bi eutectic were selected in this work. The microstructure, interfacial reaction under soldering and subsequent aging and the shear properties of Sn-Bi solder joints were studied. Bi content in Sn-Bi solder had an obvious effect on the microstructure and the distribution of Bi phases. Solid solution Sn-Bi solder was composed of the β-Sn phases embedded with fine Bi particles, while hypoeutectic Sn-Bi solder was composed of the primary β-Sn phases and Sn-Bi eutectic structure from networked Sn and Bi phases, and eutectic Sn-Bi solder was mainly composed of a eutectic structure from short striped Sn and Bi phases. During soldering with Cu, the increase on Bi content in Sn-Bi solder slightly increased the interfacial Cu6Sn5 intermetallic compound (IMC)thickness, gradually flattened the IMC morphology, and promoted the accumulation of more Bi atoms to interfacial Cu6Sn5 IMC. During the subsequent aging, the growth rate of the IMC layer at the interface of Sn-Bi solder/Cu rapidly increased from solid solution Sn-Bi solder to hypoeutectic Sn-Bi solder, and then slightly decreased for Sn-58Bi solder joints. The accumulation of Bi atoms at the interface promoted the rapid growth of interfacial Cu6Sn5 IMC layer in hypoeutectic or eutectic Sn-Bi solder through blocking the formation of Cu6Sn5 in solder matrix and the transition from Cu6Sn5 to Cu3Sn. Ball shear tests on Sn-Bi as-soldered joints showed that the increase of Bi content in Sn-Bi deteriorated the shear strength of solder joints. The addition of Bi into Sn solder was also inclined to produce brittle morphology with interfacial fracture, which suggests that the addition of Bi increased the shear resistance strength of Sn-Bi solder.

show abstract

Formation and evolution of intermetallic compounds between the In-3Ag solder and Cu substrate during soldering

Luo

et al. 2015

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

Interfacial reaction and mechanical properties between low melting temperature Sn–58Bi solder and various surface finishes during reflow reactions

Cited by 13 publications

References 25 publications

A study on the interfacial reaction of Sn58Bi/Cu soldered joints under various cooling and aging conditions

A study on the interfacial reaction of Sn58Bi/Cu soldered joints under various cooling and aging conditions

Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints

Formation and evolution of intermetallic compounds between the In-3Ag solder and Cu substrate during soldering

Contact Info

Product

Resources

About