Interfacial reactions and mechanical strength of
 Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint

백, 종훈; 유, 세훈; 한, 덕곤; 정, 승부; 윤, 정원

doi:10.5781/jwj.2017.35.6.8

Cited by 6 publications

(4 citation statements)

References 12 publications

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“…For the EPIG surface finish, the IMC phases were (Cu,Pd) 6 Sn 5 and (Pd,Cu)Sn 4 , as observed by EDS. On the other hand, the IMC of the ENEPIG surface finish was Ni 3 Sn 4 , as reported by many research groups [ 7 , 8 , 9 , 16 , 17 ]. In addition, the trapped NCA filler was observed in the lower part of the solder (see Figure 10 ).…”

Section: Resultssupporting

confidence: 63%

“…Substrate pads to which the chip bumps are bonded are also finer, and therefore, the thickness of the surface finish plated on the substrate pad should be thinner than at least half of the pad pitch. An electroless nickel electroless palladium immersion gold (ENEPIG) surface finish has been widely used for highly reliable mobile devices due to its long-term shelf life and is good for multiple heat treatments [ 7 , 8 , 9 ]. In addition, the palladium layer in the ENEPIG prevents the corrosion of the Ni–P layer, which enhances solder wettability [ 10 , 11 ].…”

Section: Introductionmentioning

confidence: 99%

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Thermo-Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish

et al. 2023

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Thermo-compression bonding (TCB) properties of Cu/SnAg pillar bumps on electroless palladium immersion gold (EPIG) were evaluated in this study. A test chip with Cu/SnAg pillar bumps was bonded on the surface-finished Cu pads with the TCB method. The surface roughness of the EPIG was 82 nm, which was 1.6 times higher than that of the ENEPIG surface finish because the EPIG was so thin that it could not flatten rough bare Cu pads. From the cross-sectional SEM micrographs, the filler trapping of the TC-bonded EPIG was much higher than that of the ENEPIG sample. The high filler trapping of the EPIG sample was due to the high surface roughness of the EPIG surface finish. The contact resistance increased as the thermal cycle time increased. The increase of the contact resistance with 1500 cycles of the thermal cycle test was 26% higher for the EPIG sample than for the ENEPIG sample.

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Section: Resultssupporting

confidence: 63%

Section: Introductionmentioning

confidence: 99%

Thermo-Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish

et al. 2023

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“…하지만 Cu 기판 사용시, 솔더와의 빠른 반응으로 인해 Cu 6 Sn 5 와 Cu 3 Sn 등의 금속간화합물(intermetallic compound, IMC)의 빠른 생성으로 인한 장기 신뢰성 저하가 발생 한다고 보고되었다 6,7) . 이를 개선하기 위해 확산방지층의 역할을 하는 Ni 도금 기술이 적용되었으며, 주로 무전 해 니켈-침지 금(Electroless Nickel Immersion Gold, ENIG) 또는 무전해 니켈-무전해 팔라듐-침지 금(Electroless Nickel Electroless Palladium Immersion Gold, ENEPIG) 도금 층이 사용되어져 왔다 8) . ENIG는 여 러 가지 우수한 특성으로 인해 장기간 사용되어져 왔지 만, Ni 부식으로 인한 블랙패드(Black Pad) 현상이 발생하기 쉬운 단점이 있다 9,10) .…”

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“…하지만 현재까지 주로 사용되어 온 ENEPIG 표면처리는 Ni의 두께가 약 3~7 ㎛ 정 도로 두껍기 때문에 공정 가격의 상승뿐만 아니라, 향 후 더욱 가속화될 미세피치 패키지 (fine-pitch package) 대응에 있어서 배선간 간격이 줄어듦에 따라 플립 칩 접합 시 인접 솔더끼리 단락되는 솔더 브릿지 (solder bridge) 발생이 증가하며, Cu Pad 사이에 Trace를 형성하기가 어려운 단점이 있다 13) . 또한 Ni 도금층의 존재는 패키지의 전기저항을 증가시켜 전기적인 성능을 저하시킨다고 보고되었다 8,13) . 따라서 Fig.…”

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Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints

백¹,

유²,

한³

et al. 2018

Journal of Welding and Joining

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In this paper, we evaluated the interfacial reactions and brittle fracture behaviors of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layers with different Ni and Pd thicknesses for fine-pitch package applications. Firstly, the interfacial reactions and mechanical reliability of Sn-3.0Ag-0.5Cu (SAC305)/thin ENEPIG solder joints were evaluated. (Cu,Ni) 6 Sn 5 intermetallic compound (IMC) was formed at all of the thin ENEPIG interfaces, and P-rich Ni layer was also observed at the joint interface of the Pd substrate with 0.3 ㎛ Ni thickness. The interfacial IMC thickness decreased with increasing Ni and Pd thicknesses. In addition, the IMC thickness was affected by the contents of the Pd plating layer. The IMC thickness for the Pd-P substrate was thicker than that for the Pd substrate. In the high-speed shear test, the brittle fracture rate decreased with increasing Ni and Pd thickness. Also, the brittle fracture rate was affected by the components of the Pd plating layer, and the brittle fracture rate for the Pd substrate was lower than that for the Pd-P substrate. The ENEPIG joint with thicker Ni plating layer had superior interfacial stability and mechanical reliability.

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Effect of Ar Plasma Treatment for Surface of Insert Metal on Property of TLP Bonding Joint for Power Module

Baek

Son

et al. 2020

Journal of Welding and Joining

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In this study, we investigated the effect of plasma treatment for the surface of an insert bonding metal on the properties of a transient liquid phase (TLP) bonding joint for a power module. Sn preforms, as the insert bonding metal for the TLP bonding, were used with and without Ar plasma treatment. To investigate the effect of Ar plasma treatment, the TLP bonding for two structures of Cu-finished Si chip/Sn preform/organic solderability preservative (OSP)-finished direct bond copper (DBC) substrate (Cu/Sn/Cu), and Ni-finished Si chip/Sn preform/Ni(P)-finished DBC substrate (Ni/Sn/Ni) was performed with 1 MPa at 300 ℃ and the bonding times were 10, 30, and 60 min, respectively. After the TLP bonding, we observed interfacial reactions and formations of intermetallic compounds (IMCs) under various bonding conditions. To evaluate mechanical properties, a shear test was also performed. Compared to the TLP bonding joint that used bare Sn preforms without Ar plasma treatment, growth of IMCs at the bonding joint that used Sn preforms with Ar plasma treatment occurred faster, and the IMCs could be formed through the entire joint despite the bonding time of 10 min. Meanwhile, by increasing the bonding time, Cu 6 Sn 5 and Cu 3 Sn were formed at the Cu/Sn/Cu TLP bonding joint, whereas Ni 3 Sn 4 , Ni-Sn-P, and Ni 3 P were observed at the Ni/Sn/Ni joint. In the case of the Cu/Sn/Cu joint, we observed that increasing Cu 3 Sn formation while increasing the bonding time could be beneficial to the shear strength of the joint. Further, shear strengths of the joint were not significantly changed under the bonding conditions after Ni 3 Sn 4 , Ni-Sn-P, and Ni 3 P IMCs were formed at the entire joint of the Ni/Sn/Ni.

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Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint

Cited by 6 publications

References 12 publications

Thermo-Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish

Thermo-Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish

Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints

Effect of Ar Plasma Treatment for Surface of Insert Metal on Property of TLP Bonding Joint for Power Module

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