Interfacial reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards

Zeng, Ke; Vuorinen, Vesa; Kivilahti, J.K.

doi:10.1109/tepm.2002.801648

Cited by 113 publications

(2 citation statements)

References 17 publications

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“…It clearly illustrates that the IMC layer was (Cu, Ni) 6 Sn 5 layer. During reflowing, Cu atoms reacted with Sn atoms to form Cu 6 Sn 5 IMCs, Ni atoms diffused from the opposite Ni-P layer to the Cu lead/solder interface and substituted for Cu atoms in Cu 6 Sn 5 IMCs due to the similarity in crystal structure, which finally led to the transformation of binary Cu 6 Sn 5 compounds to ternary (Cu, Ni) 6 Sn 5 compounds when the Ni content in (Cu, Ni) 6 Sn 5 exceeded 2 at.% [12]. The thickness of interfacial (Cu, Ni) 6 Sn 5 IMCs was 1.23 ± 0.17 µm.…”

Section: Pull Test and Fractographymentioning

confidence: 99%

Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock

et al. 2018

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Solder joints in thermally uncontrolled microelectronic assemblies have to be exposed to extreme temperature environments during deep space exploration. In this study, extreme temperature thermal shock test from −196 °C to 150 °C was performed on quad flat package (QFP) assembled with Sn-37Pb solder joints to investigate the evolution and growth behavior of interfacial intermetallic compounds (IMCs) and their effect on the pull strength and fracture behavior of Sn-37Pb solder joints under extreme temperature environment. Both the scallop-type (Cu, Ni)6Sn5 IMCs at the Cu lead side and the needle-type (Ni, Cu)3Sn4 IMCs at the Ni-P layer side changed to plane-type IMCs during extreme temperature thermal shock. A thin layer of Cu3Sn IMCs was formed between the Cu lead and (Cu, Ni)6Sn5 IMC layer after 150 cycles. The growth of the interfacial IMCs at the lead side and the Ni-P layer side was dominated by bulk diffusion and grain-boundary diffusion, respectively. The pull strength was reduced about 31.54% after 300 cycles. With increasing thermal shock cycles, the fracture mechanism changed from ductile fracture to mixed ductile–brittle fracture, which can be attributed to the thickening of the interfacial IMCs, and the stress concentration near the interface caused by interfacial IMC growth.

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Section: Pull Test and Fractographymentioning

confidence: 99%

Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock

et al. 2018

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“…Similar results have also been reported by other investigators. 6,24 In addition, the interface contained some small Ni 3 Sn 4 aggregates.…”

Section: Growth Of Imcs After Reflow Soldering and Agingmentioning

confidence: 99%

Inhomogeneous Consumption of the Electroless Ni-P Layer at the Solder Joint Formed with Sn-3.5Ag-0.7Cu

2009

Journal of Elec Materi

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This report investigates the phenomenon of interfacial serration at the joint between Sn-3.5Ag-0.7Cu solder (SAC) and electroless Ni-P underbump metallization (UBM) during aging. For comparison, the interface between SAC and electrolytic Ni UBM was also examined under similar aging conditions. The joint in the electrolytic Ni/SAC sample showed a smooth, flat interface between the Ni and intermetallic compounds, even after a long aging time. In contrast, electroless Ni-P/SAC exhibited an irregular interface, the irregularity of which became more severe with increased aging time. This observed roughness was initiated by large breaks across the P-rich layer. The breaks were filled with the overlying Ni-Sn-P phase material, which provided an easier interdiffusion path for Ni and Sn in the opposite direction. As a result, the local consumption of the Ni(-P) layer was accelerated, and the interface was serrated. The local maximum consumption rate of the Ni-P layer, as calculated from the minimum thickness of this layer in each sample with aging time, was similar to that of an electrolytic Ni layer.

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Interaction of Sn‐Based Solders with Ni(P) Substrates: Phase Equilibria and Thermochemistry

Schmetterer

Ganesan

Ipser

2012

Lead‐Free Solders: Materials Reliability for Electronics

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Interfacial reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards

Cited by 113 publications

References 17 publications

Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock

Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock

Inhomogeneous Consumption of the Electroless Ni-P Layer at the Solder Joint Formed with Sn-3.5Ag-0.7Cu

Interaction of Sn‐Based Solders with Ni(P) Substrates: Phase Equilibria and Thermochemistry

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