Interfacial reactions between pure indium solder and Au/Ni metallization

Huang, Li-Chi; Zhang, Yanping; Chen, Chih‐Ming; Hung, Liang-Yih; Wang, Yu-Po

doi:10.1007/s10854-022-08253-2

Cited by 5 publications

(2 citation statements)

References 22 publications

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“…Correlation analysis confirms that this IMC is Ni 28 In 72 . 70 This is due to the rapid dissolution of the thin Au layer into the molten In during the contact between the two phases. This situation allows a direct alloying reaction between In and Ni, causing the formation of Ni 28 In 72 at the In–Ni interface (Fig.…”

Section: Wetting Of Gallium-based Liquid Metalsmentioning

confidence: 99%

Interfacial interaction-induced super-wettability of gallium-based liquid metals: a review

Wang,

Xie

2024

J. Mater. Chem. A

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Section: Wetting Of Gallium-based Liquid Metalsmentioning

confidence: 99%

Interfacial interaction-induced super-wettability of gallium-based liquid metals: a review

Wang,

Xie

2024

J. Mater. Chem. A

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“…Recently, Pb has been banned from use in electronics devices, and many innovative Pb-free solders have been reported as promising alternatives to Pb-based solders [3][4][5], where a number of metal elements, including indium (In), bismuth (Bi), antimony (Sb), and zinc (Zn), are used to replace Pb in the solder paste. Among these alternatives, In-based and pure In solders are very attractive because of their excellent wettability, low melting temperature, great thermal fatigue resistance, and good impact resistance [6][7][8]. These make them a very encouraging prospect for low-temperature bonding and high interconnect reliability in microelectronic packaging [9].…”

Section: Introductionmentioning

confidence: 99%

A DFT Characterization of Structural, Mechanical, and Thermodynamic Properties of Ag9In4 Binary Intermetallic Compound

Cheng

2022

Metals

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The intermetallic compounds (IMCs) at the interface between the solder joint and metal bond pad/under bump metallization (UBM) exert a significant impact on the thermal–mechanical behavior of microelectronic packages because of their unique physical properties. In this study, a theoretical investigation of the physical properties, namely structural, mechanical, and thermodynamic properties, of the Ag9In4 IMC was conducted using ab initio density functional theory (DFT) calculations. The calculated equilibrium lattice constants were in good agreement with the literature experimental data. Furthermore, with the calculated elastic constants, we can derive the ductility and brittleness nature, elastic anisotropy, and direction-dependent elastic properties of Ag9In4 through several elastic indices, three-dimensional surface representation, and two-dimensional projections of elastic properties. The calculations inferred that the cubic Ag9In4 IMC confers structural and mechanical stability, ductility, relative low stiffness and hardness, and elastic anisotropy. Finally, the thermodynamic properties, i.e., Debye temperature, heat capacity, and minimum thermal conductivity, were also investigated. Evidently, the low-temperature heat capacity conforms to the Debye heat capacity theory and the high-temperature one complies with the classical Dulong–Petit law.

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