Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate

Abstract

The growth kinetics of intermetallic compound layers formed between eutectic Sn-58Bi solder and (Cu, electroless Ni-P/Cu) substrate were investigated at temperature between 70 and 120 • C for 1 to 60 days. The layer growth of intermetallic compound in the couple of the Sn-58Bi/Cu and Sn-58Bi/electroless Ni-P system satisfied the parabolic law at given temperature range. As a whole, because the values of time exponent (n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by diffusion mechanism over the temperature range studied. The apparent activation energies of Cu 6 Sn 5 and Ni 3 Sn 4 intermetallic compound in the couple of the Sn-58Bi/Cu and Sn-58Bi/electroless Ni-P were 127.9 and 81.6 kJ/mol, respectively.

IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging

“…Table 2 lists the values of the activation energy (Q) obtained from the temperature dependence of k 2 , with the data from previous works. 4,6,15,[20][21][22] Although some difference does occur in the data, our result is in good agreement with the results of these previous workers. The discrepancy among the activation energies is due to the differences in the solder alloy, 23,24) surface finish of substrates 4,20) and aging temperature range.…”

“…[1][2][3][4] Many different solder alloys have been proposed as potential Pb-free solder replacements and the most promising of these fall into the general alloy families of Sn-Cu, Sn-Ag and Sn-Ag-Cu. [5][6][7][8][9][10] It has satisfactory wettability, reliability, ductility and strength compared to other Pb-free solders.…”

Interfacial Reaction and Mechanical Characterization of Eutectic Sn–Zn/ENIG Solder Joints during Reflow and Aging

“…Therefore, the pursuit of Pb-free solder has become an important issue for electronic material research, and has led to extensive research and development work. [1][2][3][4][5][6][7][8][9][10][11][12][13][14] Many different solder alloys have been proposed as potential Pbfree solders and the most promising of these falls into the category of the Sn-Ag, Sn-Ag-Cu and Sn-Cu family of alloys. 13,14) Recently, compared with Sn-Ag solders, Sn-Zn solders have been highly recommended as a substitute for eutectic Sn-Pb solder due to their low melting point, excellent mechanical properties and low cost.…”

Liquid-Phase Reaction Sintering Behavior at below 200 °C and Electrical Sheet Resistance of Sn-58Bi/Cu Composite Pastes

“…Therefore, a low melting point is necessary for the research and development of such solders. Sn-Pb solders [12,13]. In previous reports, Sn-58Bi solder alloys undergoing tensile tests have shown relatively high intensity values compared to other solder alloys; this indicates that brittleness is high, and fracturing has been observed during plastic deformation or elastic deformation [14,15].…”