Interfacial Reactions in Sn-Ag/Co Couples

Chen, Sinn-wen; Chen, Tung-Kai; Chang, Jui-shen; Hsu, Chiou-Ting; Chen, Wei-An

doi:10.1007/s11664-013-2927-y

Search citation statements

Order By: Relevance

Paper Sections

Select...

Co-ni-sb Isothermal Section and Ni/cosb 3 Reactions At 723 K1

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2015

2023

Publication Types

Select...

Article5

Relationship

Self Cite1

Independent4

Authors

Journals

Cited by 7 publications

(1 citation statement)

References 23 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…2 [26]. The Ni/CoSb 3 interfacial reaction rates are significantly lower than those between solders, such as Sn and Sn-Ag, and those of CoSb 3 thermoelectric substrates materials, Co, Sb and CoSb 3 [27][28][29]. Furthermore, as can be observed from all the figures, the Ni layer attaches very well to the CoSb 3 substrate.…”

Section: Co-ni-sb Isothermal Section and Ni/cosb 3 Reactions At 723 Kmentioning

confidence: 97%