Interfacial Reactions in Sn/Ni-xW Couples

Yen, Yee‐Wen; Chiu, Cheng-hsin; Chen, Chih‐Ming; Lai, Ming‐Zong; Dai, Jia-Ying

doi:10.1007/s11664-014-3573-8

Cited by 5 publications

(5 citation statements)

References 9 publications

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“…Thus, the Cu6Sn5 phases detach and shift to the molten Sn to reduce surface energy. The appearance of spalling form is similar to another system [23]. This spalling indicates that very weak adhesion exists in the Cu6Sn5 grains, due to reduce the interfacial surface energy.…”

Section: Resultssupporting

confidence: 66%

“…In another system, the Cu6Sn5 at the interface detached into two parts after adding more Ni to the solder, as reported by Tsai et al [22]. Another work by Yen et al, found that adding more W content in the Ni substrate, caused more spalling in Ni3Sn4 [23]. In those cases, if an excess amount of the same alloying elements are used, there is a potential risk that the Materials Science Forum Vol.…”

Section: Resultsmentioning

confidence: 79%

“…4(a Beginning from Fig. 1(a) the Cu6Sn5 phases spalled and moved from the interface near solder to the molten Sn to reduce surface energy [23]. Cu6Sn5 detachment is clearer at longer reaction times in Sn/C1990HP couples, with longer reflow time favoring spalling as found before [24,25].…”

Section: Resultsmentioning

confidence: 92%

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Interfacial Reaction between Sn and Cu-Ti Alloy (C1990HP)

Laksono

Chang

Yan³

et al. 2019

MSF

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The interfacial reaction between pure tin and substrate with the composition of Cu-4.3 at% Ti (C1990HP) was investigated using the reaction couple technique from 240 °C until 270 °C in the range 0.5~4.0h. The SEM images show the Cu6Sn5 and small precipitated Ti2Sn3 phase formed at the Sn/C1990HP interface. In addition of Ti substantially increased the amount of intermetallic compound (IMC) at the interface which separated parts of Cu6Sn5 compounds with the inner region containing more Ti than the outer. The existence of Sn/C1990HP on the liquid/solid state reaction indicates that spalling occurred with changes in reaction time and temperature. With increased reaction temperature and time, the grain produced an abnormal condition resulting in Cu6Sn5 not accumulating at the interface and spalling into the solder in addition to grain ripening and an increase in total layer thickness. The hexagonal prism-shaped Cu6Sn5 phase is found on the top of the C1990HP substrate when the Cu6Sn5 layer detaches. The reaction phase formation, detachment, and split mechanisms are proposed in this study.

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Section: Resultssupporting

confidence: 66%

Section: Resultsmentioning

confidence: 79%

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Interfacial Reaction between Sn and Cu-Ti Alloy (C1990HP)

Laksono

Chang

Yan³

et al. 2019

MSF

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“…Because the atomic diffusion process is dynamic, the formation of ternary phases in the multicomponent systems during interfacial reactions is not abnormal. Several ternary phases were also found in the Sn-3.5Ag-0.7Cu/42 alloy, 9 Sn-Zn/Au, 26 Sn/Ni-W, 27 and Au/Sn-Zn/Cu systems. 28 The layered structure with a darker color between T 1 and T 2 layers was the second (Cu, Be) 6 Sn 5 phase.…”

Section: Resultsmentioning

confidence: 85%

“…The use of SEM/EDS and the information of phase diagrams to identify the IMCs which were formed on the interface is accepted by most researchers, and the results still are convincing. [22][23][24][25][26][27] The Cu in the Sn/Alloy 25 couple diffused to the interface at the initial reaction stage. The Cu concentration was low near the Sn side, so the Cu 6 Sn 5 phase was formed.…”

Section: Resultsmentioning

confidence: 99%

Interfacial Reactions in Lead-Free Solder/Cu-2.0Be (Alloy 25) Couples

Chang

Pasana

et al. 2021

Journal of Elec Materi

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The interfacial reactions between lead-free solders Sn, Sn-3.0 wt.% Ag-0.5 wt.% Cu (SAC) and Sn-9 wt.% Zn (SZ), and Cu-2.0 wt.% Be (Alloy 25) were investigated using the liquid/solid couple technique. The couples were reacted at 240-270°C for 0.5-10 h. The results revealed that only the scallop-shaped (Cu, Be) 6 Sn 5 phase was formed at 240°C for 0.5-2 h in the Sn/Alloy 25 couple. At a longer time (> 4 h) or higher temperature (255°C and 270°C), the (Cu, Be) 3 Sn phase was observed at the interface. In the SAC/Alloy 25 couple, the results were similar to that in the Sn/Alloy 25 couples. Only the scallopshaped (Cu, Be, Ag) 6 Sn 5 phase was formed for the short reaction time or at lower reaction temperature. With increasing reaction times and temperatures, both the (Cu, Be, Ag) 6 Sn 5 and (Cu, Be, Ag) 3 Sn phases were observed at the SAC/Alloy 25 interface. In the SZ/Alloy 25 couple, the (Cu, Sn)Zn 5 and (Cu, Sn) 5 Zn 8 phases were observed. Of these three couples, the intermetallic compound (IMC) thickness obeyed the parabolic law, and the IMC growth mechanism was diffusion-controlled.

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