Interfacial reactions in the Sn-(Ag)/(Ni,V) couples and phase equilibria of the Sn-Ni-V system at the Sn-Rich corner

Chen, Chih-Chi; Chen, Sinn-wen; Kao, C. H.

doi:10.1007/bf02692548

Cited by 25 publications

(10 citation statements)

References 20 publications

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“…They concluded that this T phase, the Sn-Ni-V ternary IMCs, was the metastable phase and only formed during the interfacial reaction. [17] Based on Chen's study and the results in phase equilibria of the Au-Sn-Zn ternary system at 160 C in this work, the T phase, Au 33-36 Zn 35-36 Sn 29-31 , is concluded to be a metastable phase, only formed during the interfacial reaction.…”

Section: Interfacial Reactions In Sn-zn/au Couplesmentioning

confidence: 87%

Phase equilibria of the Au–Sn–Zn ternary system and interfacial reactions in Sn–Zn/Au couples

Liou

Yen

2009

Intermetallics

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Section: Interfacial Reactions In Sn-zn/au Couplesmentioning

confidence: 87%

Phase equilibria of the Au–Sn–Zn ternary system and interfacial reactions in Sn–Zn/Au couples

Liou

Yen

2009

Intermetallics

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“…Vanadium (V) is introduced into Ni to overcome the ferromagnetic interference, and 7 wt% V addition is most commonly used in commercial practices. [3][4][5][6][7][8] Pb-free solders are replacing Pb-bearing solders because of the toxicity of Pb, 9,10 and eutectic Sn-Cu (Sn-0.7 wt% Cu) and Sn-Ag-Cu (SAC) alloys are the most promising Pb-free solders. 1,11,12 Interfacial reactions between solders and UBM are important for the reliability assessment of electronic products.…”

Section: Introductionmentioning

confidence: 99%

“…Although extensive investigations of the Sn-(Ag)-Cu/Ni interfacial reactions have been carried out, [14][15][16][17][18][19][20][21][22][23][24] only a few studies are available on Sn-Cu/Ni-V. 8 It has been observed that the Sn/Ni-V interfacial reactions are different from those of Sn/Ni. [5][6][7] In addition to the Ni 3 Sn 4 phase, a ternary T phase is also formed. With the 0.7 wt% Cu alloying in the solder, the Sn-0.7 wt% Cu/Ni interfacial reaction is different from that in the Sn/Ni couple.…”

Section: Introductionmentioning

confidence: 99%

Solid/solid interfacial reactions between Sn–0.7 wt% Cu and Ni–7 wt% V

Chen

Chang

2008

J. Mater. Res.

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Sn-0.7 wt% Cu alloy is an important Pb-free solder, and Ni-7 wt% V is the major diffusion barrier layer material of flip chip technology. Reactions at the Sn-0.7 wt% Cu/Ni-7 wt% V interface are examined at 160, 180, and 210°C. Only the Cu 6 Sn 5 phase is formed in the Sn-0.7 wt% Cu/Ni-7 wt% V couple reacted at 160 and 180°C; however, in addition to the Cu 6 Sn 5 and Ni 3 Sn 4 phases, a quaternary Q phase is formed in the Sn-0.7 wt% Cu/Ni-7 wt% V couple reacted at 210°C. The Q phase is a mixture of nanocrystalline Ni 3 Sn 4 phase and an amorphous phase. With longer reaction time at 210°C in the Ni-V/Q/Sn-Cu couple where the Q phase is in direct contact with solder, the Ni 3 Sn 4 phase nucleates inside the preformed Q phase, and the alternating layer phenomenon Ni-V/Q/Ni 3 Sn 4 /Q/Ni 3 Sn 4 /Cu 6 Sn 5 /Sn-Cu is observed. The interesting solid state amorphization and alternating layer phenomena at 210°C are primarily caused by the fact that Sn and Cu are fast diffusing species, while V is relatively immobile.

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“…The formation of metastable phases has been observed in various similar interfacial reaction studies. 17 A gray scallop-shaped phase region is observed adjacent to the homogeneous brighter phase layer in Fig. 3.…”

Section: Resultsmentioning

confidence: 93%

Interfacial Reactions Between Pb-Free Solders and In/Ni/Cu Multilayer Substrates

Yen

Liou

Wei

et al. 2008

Journal of Elec Materi

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This study investigates the interfacial reactions between Sn-3.0wt.% Ag-0.5wt.%Cu (SAC) and Sn-0.7wt.%Cu (SC) on In/Ni/Cu multilayer substrates using the solid-liquid interdiffusion bonding technique. Samples were reflowed first at 160°C, 180°C, and 200°C for various periods, and then aged at 100°C for 100 h to 500 h. The scalloped Cu 6 Sn 5 phase was formed at the SAC/In/Ni/Cu and SC/In/Ni/Cu interfaces. When the reflowing temperatures were 160°C and 180°C, a ternary Ni-In-Sn intermetallic compound (IMC) was formed when the samples were further aged at 100°C. This ternary Ni-In-Sn IMC could be the binary Ni 3 Sn 4 phase with extensive Cu and In solubilities, or the ternary Sn-In-Ni compound with Cu solubility, or even a quaternary compound. As the reflow temperature was increased to 200°C, only one Cu 6 Sn 5 phase was formed at the solder/substrate interface with the heat treatment at 100°C for 500 h. Mechanical test results indicated that the formation of the Ni-In-Sn ternary IMC weakened the mechanical strength of the solder joints. Furthermore, the solid-liquid interdiffusion (SLID) technique in this work effectively reduced the reflow temperature.Key words: Sn-3.0wt.%Ag-0.5wt.%Cu and Sn-0.7wt.%Cu, lead-free solder, In/Ni/Cu multilayer substrates, solid-liquid interdiffusion bonding technique

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Interfacial reactions in the Sn-(Ag)/(Ni,V) couples and phase equilibria of the Sn-Ni-V system at the Sn-Rich corner

Cited by 25 publications

References 20 publications

Phase equilibria of the Au–Sn–Zn ternary system and interfacial reactions in Sn–Zn/Au couples

Phase equilibria of the Au–Sn–Zn ternary system and interfacial reactions in Sn–Zn/Au couples

Solid/solid interfacial reactions between Sn–0.7 wt% Cu and Ni–7 wt% V

Interfacial Reactions Between Pb-Free Solders and In/Ni/Cu Multilayer Substrates

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