Interfacial reactions of Pb-free solders with Au/Pd/Ni/brass multilayer substrates

Yen, Yee‐Wen; Tsai, Po-Hao; Fang, Yang-kai; Lo, Shao-cheng; Hsieh, Yi-Ping; Lee, Chiapyng

doi:10.1016/j.jallcom.2011.12.046

Cited by 15 publications

(2 citation statements)

References 38 publications

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“…The use of SEM/EDS and the information of phase diagrams to identify the IMCs which were formed on the interface is accepted by most researchers, and the results still are convincing. [22][23][24][25][26][27] The Cu in the Sn/Alloy 25 couple diffused to the interface at the initial reaction stage. The Cu concentration was low near the Sn side, so the Cu 6 Sn 5 phase was formed.…”

Section: Resultsmentioning

confidence: 99%

“…Instead, a part of (Cu, Be) 6 Sn 5 gradually diffused toward the solder side, which was known as the spalling phenomenon due to the reduction of the surface energy. 23,24 With an increase of reaction temperature, the diffusion rate of each element was increased as well. A large amount of Sn atoms and Cu atoms for Alloy 25 substrate rapidly interdiffused and reacted to form IMC at the interface.…”

Section: Resultsmentioning

confidence: 99%

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Interfacial Reactions in Lead-Free Solder/Cu-2.0Be (Alloy 25) Couples

Chang

Pasana

et al. 2021

Journal of Elec Materi

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The interfacial reactions between lead-free solders Sn, Sn-3.0 wt.% Ag-0.5 wt.% Cu (SAC) and Sn-9 wt.% Zn (SZ), and Cu-2.0 wt.% Be (Alloy 25) were investigated using the liquid/solid couple technique. The couples were reacted at 240-270°C for 0.5-10 h. The results revealed that only the scallop-shaped (Cu, Be) 6 Sn 5 phase was formed at 240°C for 0.5-2 h in the Sn/Alloy 25 couple. At a longer time (> 4 h) or higher temperature (255°C and 270°C), the (Cu, Be) 3 Sn phase was observed at the interface. In the SAC/Alloy 25 couple, the results were similar to that in the Sn/Alloy 25 couples. Only the scallopshaped (Cu, Be, Ag) 6 Sn 5 phase was formed for the short reaction time or at lower reaction temperature. With increasing reaction times and temperatures, both the (Cu, Be, Ag) 6 Sn 5 and (Cu, Be, Ag) 3 Sn phases were observed at the SAC/Alloy 25 interface. In the SZ/Alloy 25 couple, the (Cu, Sn)Zn 5 and (Cu, Sn) 5 Zn 8 phases were observed. Of these three couples, the intermetallic compound (IMC) thickness obeyed the parabolic law, and the IMC growth mechanism was diffusion-controlled.

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