Interfacial slippage of inorganic electronic materials on plastic substrates

Dai, Longchao; Feng, Xue; Liu, Bin; Fang, Daining

doi:10.1063/1.3517488

Cited by 21 publications

(3 citation statements)

References 17 publications

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“…Once the YSZ substrate was compressed by pushing the moving end, the substrate’s end-to-end length decreased to 0.81 cm. The substrate’s bending radius

R_{n o m}

can be calculated as 0.42 cm from Equation (1) [33,34]

R_{n o m} = \frac{L}{2 π \sqrt{\frac{d L}{L} - \frac{π^{2} h_{s}^{2}}{12 L^{2}}}}

…”

Section: Resultsmentioning

confidence: 99%

Flexible Mixed-Potential-Type (MPT) NO2 Sensor Based on An Ultra-Thin Ceramic Film

You

Cui

2017

Sensors

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A novel flexible mixed-potential-type (MPT) sensor was designed and fabricated for NO2 detection from 0 to 500 ppm at 200 °C. An ultra-thin Y2O3-doped ZrO2 (YSZ) ceramic film 20 µm thick was sandwiched between a heating electrode and reference/sensing electrodes. The heating electrode was fabricated by a conventional lift-off process, while the porous reference and the sensing electrodes were fabricated by a two-step patterning method using shadow masks. The sensor’s sensitivity is achieved as 58.4 mV/decade at the working temperature of 200 °C, as well as a detection limit of 26.7 ppm and small response time of less than 10 s at 200 ppm. Additionally, the flexible MPT sensor demonstrates superior mechanical stability after bending over 50 times due to the mechanical stability of the YSZ ceramic film. This simply structured, but highly reliable flexible MPT NO2 sensor may lead to wide application in the automobile industry for vehicle emission systems to reduce NO2 emissions and improve fuel efficiency.

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“…Once the YSZ substrate was compressed by pushing the moving end, the substrate’s end-to-end length decreased to 0.81 cm. The substrate’s bending radius

R_{n o m}

can be calculated as 0.42 cm from Equation (1) [33,34]

R_{n o m} = \frac{L}{2 π \sqrt{\frac{d L}{L} - \frac{π^{2} h_{s}^{2}}{12 L^{2}}}}

…”

Section: Resultsmentioning

confidence: 99%

Flexible Mixed-Potential-Type (MPT) NO2 Sensor Based on An Ultra-Thin Ceramic Film

You

Cui

2017

Sensors

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“…So far, few reliable and applicable results can be found on flexible electronics subjected to bending, the most common loading in application. [9], [11]- [12].…”

Section: Introductionmentioning

confidence: 98%

Interfacial Failure in Flexible Electronic Devices

Chen

Lin

et al. 2014

IEEE Electron Device Lett.

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Flexible inorganic electronics with the delicate integration of stiff electronic films on soft substrate have attracted much attention recently. For the large mismatch of mechanical properties between the soft substrate and stiff electronic films in such devices, interfacial failures are always extremely dangerous. In this letter, we present theoretical analysis for the interfacial failures based on fracture mechanics and establish the criteria for the failure modes. It is found that the thin films always slip first and then transit to delamination from the substrate as the increasing of applied loading. The theoretical prediction is consistent with the experiment, which can guide the design and evaluate the reliability of flexible electronics.

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“…Hence, interfacial failures become more dangerous than material cracks. Dai et al [33] analyzed the bendability of the slipping failure mechanism by the critical radius of the system curvature for the slipping crack propagation at its interface. Chen et al [34] quantitatively explained the interfacial failure behaviors using the slip zone model combining with strength theory.…”

Section: Introductionmentioning

confidence: 99%

A novel thermal-mechanical model and the characteristics of interfacial stress in the laminated structure for flexible electronics

Xu¹,

Qiu²,

Yuan³

et al. 2021

J. Phys. D: Appl. Phys.

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Flexible electronics have attracted rapidly growing interest owing to their great potential utility in numerous fundamental and emerging fields. However, there are urgent issues that remain as pending challenges in the interfacial stress and resulting failures of flexible electronics, especially for heterogeneous laminates of hard films adhered to soft polymer substrates under thermal and mechanical loads. This study focuses on the interfacial stress of a representative laminated structure, that is, the Si film is adhesively bonded to soft polydimethylsiloxane with a plastic polyethylene terephthalate substrate. An novel thermal-mechanical coupling model for this flexible structure is established in this paper, which presents the essential characteristics of interfacial shear stress. In addition, under thermal and mechanical loads, a typical case is investigated by combining an analytical solution with numerical results using the differential quadrature method. Furthermore, thermal and mechanical loads, material and geometry parameters are quantitatively explored for their influences on the interfacial shear stress. Targeted strategies for decreasing stress are also suggested. In conclusion, the thermal-mechanical model and application case analyses contribute to enhancing the design of interfacial reliability for flexible laminated structures.

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Interfacial slippage of inorganic electronic materials on plastic substrates

Cited by 21 publications

References 17 publications

Flexible Mixed-Potential-Type (MPT) NO2 Sensor Based on An Ultra-Thin Ceramic Film

Flexible Mixed-Potential-Type (MPT) NO2 Sensor Based on An Ultra-Thin Ceramic Film

Interfacial Failure in Flexible Electronic Devices

A novel thermal-mechanical model and the characteristics of interfacial stress in the laminated structure for flexible electronics

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