Interfacial Stability in Bi₂Te₃ Thermoelectric Joints

Abstract

Bismuth telluride (Bi 2 Te 3 )-based thermoelectric materials are well-known for their high figure-of-merit (zT value) in the low-temperature region. Stable joints in the module are essential for creating a reliable device for long-term applications. This study used electroless Co−P to prevent a severe interfacial reaction between the joints of solder and Bi 2 Te 3 . A thick and brittle SnTe intermetallic compound layer was successfully inhibited. The strength of the joints improved, and the fracture mode became more ductile; furthermore, there was no significant degradation of thermoelectric properties after depositing the Co−P layer after long-term aging. The result suggests that electroless Co−P could enhance the interfacial stability of the joints and be an effective diffusion barrier for Bi 2 Te 3 thermoelectric modules.

Next-generation thermoelectric cooling modules based on high-performance Mg3(Bi,Sb)2 material

“…The stability of performance after 6 months is comparable to that of the commercial Bi 2 Te 3 -based modules. 53 In conclusion, full-scale MBST/SBTS thermoelectric cooling modules (7,31, and 71 pairs) with a 23% higher performance-cost ratio to that of the commercial Bi 2 Te 3 modules were demonstrated in this work. Owing to the high thermoelectric performance and enhanced stability of the n-type Mg 3.2 Bi 1.4975 Sb 0.5 Te 0.0025 material, low contact resistance, and low thermal stress of the Mg 2 Cu-based interfacial layer, superior thermoelectric cooling performance, and service durability were realized in our modules.…”

Research Progress of Interfacial Design between Thermoelectric Materials and Electrode Materials

“…For In–48Sn/Bi 2 Te 3 –SiC specimens, indium penetrated rapidly into the substrate, whereas Sn rarely diffused, but the addition of Co–P reduced the growth of IMCs . The Co–P diffusion barrier has also been shown to increase the strength of the joint . It seems that Co–P could be an effective diffusion barrier for application in Bi 2 Te 3 -based thermoelectric modules.…”

“…54 The Co−P diffusion barrier has also been shown to increase the strength of the joint. 55 It seems that Co−P could be an effective diffusion barrier for application in Bi 2 Te 3 -based thermoelectric modules.…”

Novel low-carbon energy solutions for powering emerging wearables, smart textiles, and medical devices

“…123 Because of the existence of cold and hot edges at the temperature gradient, these materials must have low temperature conductivity and high electrical conductance in order to create a substantial quantity of electric potential. 124 In this regard, low thermal conductivity materials such as bismuth telluride (Bi 2 Te 3 ), 125 silicon germanium (SiGe), 126 and lead telluride (PbTe) 127 have shown promising activity in thermoelectric generators, apart from the high prices of bismuth and tellurium. 126,128 Most exploration on thermoelectric materials has concentrated on increasing the Seebeck coefficient and lowering the heat conductance (i.e.…”