Interfacial structure and growth kinetics of intermetallic compounds between Sn-3.5Ag solder and Al substrate during solder process

Yao, Yao; Zhou, Jian; Xue, Feng; Xu, Chunxiang

doi:10.1016/j.jallcom.2016.04.263

Cited by 36 publications

(14 citation statements)

References 30 publications

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“…The value of n was determined from the slope of plot between log Y with log t. It is well known that volume of n has a significant effect on the growth rate of the intermetallic phase. When n=1/3, the intermetallic phase growth follows the grain boundary diffusion-controlled; when n=1/2, the intermetallic phase growth follows the volume diffusion-controlled; when n=1, the intermetallic phase growth follows the reaction-controlled [21][22][23]. The time exponent values for Cu6Sn5 and Cu 3 Sn phases were 0.083 and 0.682, respectively.…”

Section: Y= Kt N (2)mentioning

confidence: 98%

Influences of soldering time on wettability and intermetallic phase between Sn-3.0Cu solder and copper substrate

Mookam

Kanlayasiri

2018

MATEC Web Conf.

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In this paper, the influences of soldering time on the wettability and intermetallic phase between Sn-3.0Cu lead-free solder and copper substrate were investigated. Reflow soldering was performed at 350 ° C under variable soldering times of 10, 20, 40, 60, 120, 240 and 480 s. The results indicated that the wettability and intermetallic growth depend on the soldering time. In addition, the Cu6Sn5 and Cu3Sn intermetallic phases with a hexagonal crystal structure were found between the lead-free solder and the copper substrate. The growth of intermetallic phases increased with soldering time, and the growth of intermetallic phases remarkably depended on grain boundary diffusion and was volume diffusion-controlled for Cu6Sn5 and Cu3Sn, respectively.

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Section: Y= Kt N (2)mentioning

confidence: 98%

Influences of soldering time on wettability and intermetallic phase between Sn-3.0Cu solder and copper substrate

Mookam

Kanlayasiri

2018

MATEC Web Conf.

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“…Uji kaji piawai ini merupakan uji kaji wajib dalam industri elektronik yang bertujuan untuk memastikan kualiti dan kebolehharapan sambungan pateri. Pertumbuhan lapisan IMC berlaku melalui proses resapan yang menyebabkan lapisan yang tumbuh tersebut selalunya tidak sekata daripada segi ketebalan (Yao et al 2016). Ketidaksekataan ini menghasilkan lapisan IMC yang seakan berbentuk gunung-ganang dan lembah (Kanlayasiri & Sukpimai 2016).…”

Section: Pengenalanunclassified

Penilaian Semula Pengukuran Kuantitatif Stereometri terhadap Pertumbuhan Sebatian antara Logam bagi Sambungan Pateri

Bakar¹,

Jalar²,

Ismail³

2018

JSM

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Reassessment of Stereometric Quantitative Measurements on the Growth of Intermetallic Compound for Solder Connections) Maria abu bakar, azMan Jalar* & roslina isMail abstrak Pencerapan dua dimensi (2D) yang diperoleh daripada keratan rentas sampel selalunya digunakan untuk mendapatkan maklumat ketebalan lapisan sebatian antara logam (IMC). Walau bagaimanapun, pencerapan 2D amatlah terhad berbanding maklumat yang sepatutnya diperoleh daripada struktur tiga dimensi (3D) sampel. Kajian ini bertujuan untuk menilai semula kaedah pengukuran lapisan IMC daripada pemerhatian 2D dengan mempertimbangkan faktor-faktor sebenar dalam bentuk 3D IMC. Nilai mod ketebalan didapati lebih mewakili nilai ketebalan IMC setelah mempertimbangkan pelbagai faktor stereometri berbanding dengan nilai purata. Ini memberikan suatu penanda aras dalam aktiviti menentukan ketebalan lapisan IMC berdasarkan pencerapan 2D daripada struktur 3D.

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“…[1][2][3][4][5][6] X. Chen et al [7][8] observed the interfacial structure of Sn-9Zn/Al and found that the metallurgical bonding between them was carried out due to the dissolution of Al into the solder.To improve the Sn-9Zn/Al joint performance, M. L. Huang et al 3-5, incorporated small amounts of Ag, Al or Ni into a Sn-Zn solder to obtain higher shear strength and corrosion resistance of the joints. Besides the Sn-Zn solder, Y. Yao et al 10 tried to use a Sn-3.5Ag solder, and found that the bonding between the solder and Al was realized due to the formation of Ag-Al intermetallic compounds (IMCs).On the other hand, due to the poor wettability of Sn-based solders on Al during soldering, 2,6 ultrasonic assisting has also been introduced into Al-soldering in recent years, which helps increase the joint strength and expand the soldered Al-alloys from the 1000 series to 5000-7000 series. [11][12][13][14][15][16] Although Al-soldering was first illustrated by Spraragen in 1940, 17 there are still some issues concerning the wettability arising from the existence of an alumina oxide film, deterioration of the joint strength arising from the formation of brittle intermetallic compounds (IMCs) at the interface and poor corrosion resistance arising from a large difference in the electrode potential between Al and solders.…”

Section: Introductionmentioning

confidence: 99%

Effect of a nano-ZnO addition on the wettability and interfacial structure of Sn-based Pb-free solders on aluminum

Wang¹,

Ding²,

Wang³

2020

Mater. Tehnol.

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Aluminum soldering with a low-temperature Pb-free solder is very important in electronics and radiator applications. In this paper, a nano-ZnO addition was introduced into the interfacial reaction between a Sn-3.5Ag or Sn-9Zn solder and aluminum to improve the wettability, interfacial structure and mechanical properties of joints. A spreading test showed that the Sn-3.5Ag solder had higher wettability than Sn-9Zn. With the nano-ZnO addition, the wettability of these two solders was obviously improved. An analysis of the interfacial structure showed that the bonding between Sn-Zn and Al was realized with a Zn-Al solid solution, while that between the Sn-3.5Ag solder and Al was realized with an Ag2Al intermetallic layer. The introduction of nano-ZnO obviously accelerated the formation of Ag2Al of Sn-3.5Ag on Al. Finally, a shear test showed that the nano-ZnO addition helped increase the shear strength of Al solder joints.

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Interfacial structure and growth kinetics of intermetallic compounds between Sn-3.5Ag solder and Al substrate during solder process

Cited by 36 publications

References 30 publications

Influences of soldering time on wettability and intermetallic phase between Sn-3.0Cu solder and copper substrate

Influences of soldering time on wettability and intermetallic phase between Sn-3.0Cu solder and copper substrate

Penilaian Semula Pengukuran Kuantitatif Stereometri terhadap Pertumbuhan Sebatian antara Logam bagi Sambungan Pateri

Effect of a nano-ZnO addition on the wettability and interfacial structure of Sn-based Pb-free solders on aluminum

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