2009
DOI: 10.1088/0957-0233/20/9/095301
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Interferometry based high-precision dilatometry for dimensional characterization of highly stable materials

Abstract: We present an optical dilatometer for high-accuracy and high-resolution absolute measurement of the linear coefficient of thermal expansion (CTEl). Based on a highly symmetric differential heterodyne interferometer, dimensional changes of a tubular shaped specimen under controlled thermal conditions can be characterized. Our measurement facility is located in vacuum where the test specimen can be temperature controlled in a temperature range between 20 °C and 60 °C. A thermally stable support and two identical… Show more

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Cited by 29 publications
(18 citation statements)
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“…It is a well-known fact that most materials change their dimensions as a function of temperature which is called thermal expansion (Cordero et al 2009). The fractional change in dimensions of a material per unit rise in temperature is often characterised by the coefficient of thermal expansion (CTE) which is recognised as a fundamental parameter in mechanical and structural design applications of materials (Zeisig et al 2002).…”
Section: Introductionmentioning
confidence: 99%
“…It is a well-known fact that most materials change their dimensions as a function of temperature which is called thermal expansion (Cordero et al 2009). The fractional change in dimensions of a material per unit rise in temperature is often characterised by the coefficient of thermal expansion (CTE) which is recognised as a fundamental parameter in mechanical and structural design applications of materials (Zeisig et al 2002).…”
Section: Introductionmentioning
confidence: 99%
“…In order to very accurately measure the linear thermal expansion coefficient of precision items such as gauge blocks, optical interferometer based wavelength measurements [8], and interferometric dilatometetry [9], have been used to obtain deformation values. A displacement measuring interferometeric system using a heterodyne scheme [10], is another technique that provides high accuracy. However, all of the interferometeric systems are very sensitive to their external environment, involve a difficult alignment process and can be physically too large for many applications.…”
Section: Introductionmentioning
confidence: 99%
“…Advanced materials and connections demand validation of medium to long-term, if not life-time, stability to the picometer level, e.g. C/SiC, CFRP and diffusion bonded junctions [1,2]. Highest level position sensing and control require displacement sensors that not only do provide picometer-level sensitivity (resolution) and precision (stability) but also accuracy.…”
Section: Introductionmentioning
confidence: 99%