Interlaced, Nanostructured Interface with Graphene Buffer Layer Reduces Thermal Boundary Resistance in Nano/Microelectronic Systems

Abstract

Improving heat transfer in hybrid nano/microelectronic systems is a challenge, mainly due to the high thermal boundary resistance (TBR) across the interface. Herein, we focus on gallium nitride (GaN)/diamond interface-as a model system with various high power, high temperature, and optoelectronic applications-and perform extensive reverse nonequilibrium molecular dynamics simulations, decoding the interplay between the pillar length, size, shape, hierarchy, density, arrangement, system size, and the interfacial heat transfer mechanisms to substantially reduce TBR in GaN-on-diamond devices. We found that changing the conventional planar interface to nanoengineered, interlaced architecture with optimal geometry results in >80% reduction in TBR. Moreover, introduction of conformal graphene buffer layer further reduces the TBR by ∼33%. Our findings demonstrate that the enhanced generation of intermediate frequency phonons activates the dominant group velocities, resulting in reduced TBR. This work has important implications on experimental studies, opening up a new space for engineering hybrid nano/microelectronics.

Enhanced Thermal Conduction Through Nanostructured Interfaces

“…Our approach is inspired by macro-scale fin arrays that are conventionally used to enhance heat transfer between solid surfaces and fluids by increasing contact area [29]. Previous research has explored the use of micro-structured surfaces for thermal interface materials at the chip packaging level [30,31], and computational studies have suggested that the extension of this idea to atomic length scales can be beneficial to interfacial conduction [32]. However, the demonstration of nanostructured interfaces between solids in intimate contact, e.g.…”

A Review on Phonon Transport within Polycrystalline Materials

“…[175][176][177][178] Along this line, some interfacial improvement on the phonon transport can be achieved by optimizing the interfacial nanostructure. [157,160,[179][180][181][182][183] On the other side, a deposited diamond film as a heat spreader on top of the device is also less useful when nanoscale columnar grains are found. [152] New growth conditions to maximize the crystallization must be addressed to reach the full potential of diamond for thermal transport.…”

Merger of Energetic Affinity and Optimal Geometry Provides New Class of Boron Nitride Based Sorbents with Unprecedented Hydrogen Storage Capacity

“…It is known that physical properties such as mechanical, thermal, and electrical properties of 2D materials (e.g., BN sheets) are affected by ripples. [35][36][37][38][39][40][41] For instance, in the case of mechanical properties, the ripples provide high toughness (due to extra stretch as a result of unfolding of the ripples) while the ultimate strength is not sacrificed; two properties that are conflicting (i.e., high toughness and high strength). [42][43][44][45][46][47][48][49][50] Thus, having these sheets slightly crumpled can increase their toughness to be more flexible (stretchable) to internal pressure or external loads, thereby increasing their safety due to impact, damage, etc, which is one of the major concerns for safe H 2 storage and transport.…”

“…While BN sheets are typically flat, the synthesis conditions (impurities, asymmetric junctions, etc) may lead to wavy sheets that may have ripples, such as the 3D BN studied here. It is known that physical properties such as mechanical, thermal, and electrical properties of 2D materials (e.g., BN sheets) are affected by ripples . For instance, in the case of mechanical properties, the ripples provide high toughness (due to extra stretch as a result of unfolding of the ripples) while the ultimate strength is not sacrificed; two properties that are conflicting (i.e., high toughness and high strength) .…”