2021
DOI: 10.1016/j.msea.2021.140879
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Interlayer design for partial transient liquid phase bonding of titanium and copper

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Cited by 8 publications
(4 citation statements)
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“…Therefore, at a constant temperature, solidification occurs. This is called isothermal solidification, which is more convenient than solidification by cooling [11,12,21,[13][14][15][16][17][18][19][20]. In previous studies, similar and dissimilar TLP bonding of several Ni-based superalloys such as IN-617 [22][23][24][25], IN-939 [16,[26][27][28],…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, at a constant temperature, solidification occurs. This is called isothermal solidification, which is more convenient than solidification by cooling [11,12,21,[13][14][15][16][17][18][19][20]. In previous studies, similar and dissimilar TLP bonding of several Ni-based superalloys such as IN-617 [22][23][24][25], IN-939 [16,[26][27][28],…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, at a constant temperature, solidification occurs. This is called isothermal solidification, which is more convenient than solidification by cooling [11,12,21,[13][14][15][16][17][18][19][20]. In previous studies, similar and dissimilar TLP bonding of several Ni-based superalloys such as IN-617 [22][23][24][25], IN-939 [16,[26][27][28],…”
Section: Introductionmentioning
confidence: 99%
“…Transient liquid phase (TLP) bonding has the advantages of diffusion welding and brazing technologies [17,18], and has been successfully applied to join the same [19][20][21][22][23][24] or dissimilar metals [25,26]. The melting temperature of filler metal is lower than that of the matrix due to the addition of elements, such as B, P, and Si.…”
Section: Introductionmentioning
confidence: 99%