Nonvolatile memory devices based on ferroelectric Hf
x
Zr1–x
O2 (HZO) show great promise for back-end integrable storage
and for
neuromorphic accelerators, but their adoption is held back by the
inability to scale down the HZO thickness without violating the strict
thermal restrictions of the Si CMOS back end of line. In this work,
we overcome this challenge and demonstrate the use of nanosecond pulsed
laser annealing (NLA) to locally crystallize areas of an ultrathin
(3.6 nm) HZO film into the ferroelectric orthorhombic phase. Meanwhile,
the heat induced by the pulsed laser is confined to the layers above
the Si, allowing for back-end compatible integration. We use a combination
of electrical characterization, nanofocused scanning X-ray diffraction
(nano-XRD), and synchrotron X-ray photoelectron spectroscopy (SXPS)
to gain a comprehensive view of the change in material and interface
properties by systematically varying both laser energy and the number
of laser pulses on the same sample. We find that NLA can provide remanent
polarization up to 2P
r= 11.6 μC/cm2 in 3.6 nm HZO, albeit with a significant wake-up effect.
The improved TiN/HZO interface observed by XPS explains why device
endurance goes beyond 107 cycles, whereas an identical
film processed by rapid thermal processing (RTP) breaks already after
106 cycles. All in all, NLA provides a promising approach
to scale down the ferroelectric oxide thickness for emerging HZO ferroelectric
devices, which is key for their integration in scaled process nodes.