2009
DOI: 10.1134/s0020168509090052
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Interlayer nanoparticles of copper, nickel, and silver in Bi2Te3

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Cited by 8 publications
(3 citation statements)
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“…As a typical transition-metal dopant candidate, Cu has been investigated in several kinds of TE materials and consistently brought positive effects, especially in improving TE performance for Bi 2 Te 3 -based alloys. The Cu atom was found to be inserted or substituted into the Bi 2 Te 3 -based lattice, showing amphoteric behavior, and could even be precipitated during fabrication technique changes. Cu addition also prevents the oxidation of Bi 2 Te 3 and improves the reproducibility of the results. , Furthermore, it has been demonstrated that the Cu dopant can enlarge the band gap of Cu-modified (Bi, Sb) 2 Te 3 , and how the Cu doping amount can effectively modulate the TE properties in p -type Bi 2 Te 3 -based alloys. Nevertheless, the practical implementation of TE devices is limited by the hitherto lower average figure of merit ( zT ave ∼ 1 in the temperature range of 300–500 K), and the role of Cu in the electronic structures and phonon dynamics of p -type (Bi, Sb) 2 Te 3 materials remains elusive to the best of our knowledge.…”
Section: Introductionmentioning
confidence: 99%
“…As a typical transition-metal dopant candidate, Cu has been investigated in several kinds of TE materials and consistently brought positive effects, especially in improving TE performance for Bi 2 Te 3 -based alloys. The Cu atom was found to be inserted or substituted into the Bi 2 Te 3 -based lattice, showing amphoteric behavior, and could even be precipitated during fabrication technique changes. Cu addition also prevents the oxidation of Bi 2 Te 3 and improves the reproducibility of the results. , Furthermore, it has been demonstrated that the Cu dopant can enlarge the band gap of Cu-modified (Bi, Sb) 2 Te 3 , and how the Cu doping amount can effectively modulate the TE properties in p -type Bi 2 Te 3 -based alloys. Nevertheless, the practical implementation of TE devices is limited by the hitherto lower average figure of merit ( zT ave ∼ 1 in the temperature range of 300–500 K), and the role of Cu in the electronic structures and phonon dynamics of p -type (Bi, Sb) 2 Te 3 materials remains elusive to the best of our knowledge.…”
Section: Introductionmentioning
confidence: 99%
“…They focused on the effect of Cu on carrier concentration and electronic properties. [11][12][13][14][15] Despite the considerable research on this material, the effects of Cu intercalation on the thermoelectric properties of Bi 2 Te 3 have not yet been systematically studied.…”
Section: Introductionmentioning
confidence: 99%
“…As shown by Kakhramanov [19] and Aleskerov and Kakhramanov [20], the intercalation of Ві 2 Те 3 with metal (Cu, Ag, and Ni) atoms leads to accumulation, redistribution, and formation of intercalate nanoinclusions in inter layer spaces along the plane of the (0001) layers; that is, an additional layer of metal nanoinclusions forms in the crystal lattice. A similar result was obtained by Bakhtinov et al [11], who found that intercalation of the layered semiconductor In 2 Se 3 with cobalt in a static magnetic field led to the formation of fcc Co nanostructures in the van der Waals gaps.…”
Section: Resultsmentioning
confidence: 96%