Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates

Chiu, M. Y.; Wang, S. S.; Chuang, Tung‐Han

doi:10.1007/s11664-002-0105-8

Cited by 45 publications

(26 citation statements)

References 17 publications

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“…[1][2][3][4][5][6][7][8]. To avoid the excessive loss of solid metals in contact with the alloys during soldering, data on metal dissolution rates in molten solders are needed.…”

Section: Introductionmentioning

confidence: 99%

Dissolution Kinetics of Nickel in Lead-free Sn-Bi-In-Zn-Sb Soldering Alloys

Barmak

Berry

Khoruzha³

et al. 2007

MRS Proc.

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The dissolution process of nickel in liquid Pb-free 87.5% Sn-7.5% Bi-3% In-1% Zn-1% Sb and 80% Sn-15% Bi-3% In-1% Zn-1% Sb soldering alloys has been investigated by the rotating disc technique at 250-450°C. The temperature dependence of the nickel solubility in the solders obeys a relation of the Arrhenius type c s = 4.94 × 10 2 exp (-39500/RT) % for the former alloy and c s = 4.19 × 10 2 exp (-40200/RT) % for the latter, where R is in J mol -1 K -1 (8.314 J mol -1 K -1 ) and T in K. The solubility values of nickel in the alloys differ considerably, while the dissolution rate constants are rather close. The data presented can be used to evaluate (i) the thickness of the dissolved portion of the solid nickel material during soldering, (ii) the extent of saturation of a solder with nickel and (iii) the effect of dissolution on the growth rate of intermetallic layers at the Ni-solder interface.

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“…[1][2][3][4][5][6][7][8]. To avoid the excessive loss of solid metals in contact with the alloys during soldering, data on metal dissolution rates in molten solders are needed.…”

Section: Introductionmentioning

confidence: 99%

Dissolution Kinetics of Nickel in Lead-free Sn-Bi-In-Zn-Sb Soldering Alloys

Barmak

Berry

Khoruzha³

et al. 2007

MRS Proc.

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“…No systematic investigations relevant to the phase equilibria and thermodynamic properties of the Ni-Sn-Zn ternary system have been published, although it was reported that Ni 3 Sn 4 has significant solubility of Zn. 17,19 Based on the constituent binary systems, 21-23 the thermodynamic database for the ternary system is thus extrapolated to calculate the scale factor I=I 0 for the heterogeneous nucleation rate of various phases at the Sn-Zn/Ni interfaces. Since c-Ni 5 Zn 21 has formed during the preparation of the Sn-Zn/Ni couples, the present calculations are thus only carried out for 673 K (Fig.…”

Section: Nucleation Kinetics Considerationmentioning

confidence: 99%

“…To date, numerous studies relevant to interfacial reactions between Sn-Zn solder alloys and metallic substrates such as Cu and Ni have been published. [11][12][13][14][15][16][17][18][19][20] Chan et al 18 studied liquid/ solid Sn-9wt.%Zn/Ni couples at soldering temperatures ranging from 250°C to 350°C. They observed c-Ni 5 Zn 21 formation at the interfaces and determined that its growth was diffusion controlled.…”

Section: Introductionmentioning

confidence: 99%

Interfacial Reactions Between Sn-Zn Alloys and Ni Substrates

Zhu

Liu

Wang

et al. 2009

Journal of Elec Materi

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Interfacial reactions between Sn-Zn alloys and Ni substrates after annealing at 463 K have been studied. Only one intermetallic compound (IMC), c-Ni 5 Zn 21 , was observed at the Sn-Zn/Ni interfaces, although other IMC(s) in the Ni-Sn and Ni-Zn system can stably exist at this temperature. Taking into account nucleation along with diffusion kinetics, formation of the reaction product has been reasonably modeled. In addition, growth kinetics for the reaction layer has been quantified. The results indicate that the growth rate of the c-Ni 5 Zn 21 layer increases with Zn content, and that the layer growth obeys a parabolic law with annealing time, implying a diffusion-controlled mechanism.

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“…), see, for example, [1][2][3][4][5]. In Europe the extensive search for new lead-free soldering materials is now coordinated by COST Action MP0602 till 2011.…”

Section: Introductionmentioning

confidence: 99%

Physical properties of some Sn-based melts

Сидоров¹,

Упоров²,

Rozitsina³

et al. 2011

EPJ Web of Conferences

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Abstract. The physical properties (viscosity, density, electroresistivity and magnetic susceptibility) of pure tin, copper, silver, some binary (Sn -Ag, Sn -Cu, Sn -Bi, Sn -Zn) and ternary (Sn-Ag-Cu, Sn-BiAg, Sn-Bi-Zn) alloys with near eutectic compositions are investigated in wide temperature ranges. The irreversible decrease of viscosity in pure tin melt is discovered at 820 0 С during heating. The similar anomaly with the following hysteresis of dynamic viscosity was fixed for binary and ternary alloys but at higher temperatures -900 0 С and 950 0 С respectively. For all the systems it was shown that the alloys with eutectic compositions differ significantly in their electric and magnetic properties from hypo-and hypereutectic ones. Qualitative and quantitative metallographic analysis for Sn-3.8wt.%Ag-0.7wt.%Cu samples, heated low and above characteristic temperatures, showed the influence of melt overheating on crystallization kinetics. . Introduction.Because of the toxicity of lead, traditional Sn-Pb solders are now being replaced with Sn-base soldering alloys containing additions of other metals (Ag, Bi, Zn etc.), see, for example, [1][2][3][4][5]. In Europe the extensive search for new lead-free soldering materials is now coordinated by COST Action MP0602 till 2011. However, physical properties of these new solders at high temperatures, especially in liquid state, are practically unknown. In this paper we present experimental results on density (obtained by gamma-penetration method), viscosity (by torsion oscillation method), electroresistivity (by contactless method in rotating magnetic field) and magnetic susceptibility (by Faraday's method) for pure liquid tin, copper and silver, some binary (Sn-Ag, Sn-Cu, Sn-Bi, Sn-Zn) and ternary (Sn-Ag-Cu, Sn-Bi-Ag, Sn-Bi-Zn) alloys with near eutectic compositions in wide temperature ranges.

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Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates

Abstract: The Sn-8Zn-3Bi (wt.%) solder was prepared by encapsulating pure Sn (99.9%), Zn (99.

Cited by 45 publications

References 17 publications

Dissolution Kinetics of Nickel in Lead-free Sn-Bi-In-Zn-Sb Soldering Alloys

Dissolution Kinetics of Nickel in Lead-free Sn-Bi-In-Zn-Sb Soldering Alloys

Interfacial Reactions Between Sn-Zn Alloys and Ni Substrates

Physical properties of some Sn-based melts

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