Intermetallic phase formation in thin solid-liquid diffusion couples

Microstructure and shear strength of a Au–In microjoint

“…It is also noted that the duration of hot pressing shows insigni®cant eect on the measured shear strength. Nevertheless, the shear strength of the Au/In/Au microjoints is apparently higher than that of the pure In, likely due to a dierence in the defects content in the In [6]. Fig.…”

“…From the processing point of view, indium has lower melting point, 156 C, than that of tin, 232 C, thus the joining temperature can be reduced further. To take advantage of this merit and also improve the service life of a In-containing microjoint, a new bonding technique, called solid-liquid interdiusion bonding (SLID) [5,6], has recently been introduced in electronic packaging industry.…”

Effect of thermal aging on the interfacial reactions of tin-based solder alloys and copper substrates and kinetics of formation and growth of intermetallic compounds

“…In the tin/copper and tin-rich-alloys/copper joint systems, the intermetallic Cu 6 Sn 5 (h'-phase) formed immediately upon contact of the liquid solder with the copper substrate [7,8]. Then, the intermetallic compound grew rapidly [9,10].…”

DC measurement of electrical contacts between strands in superconducting cables for the LHC main magnets

“…Inside the strand, at the Cu/SnAg boundary, Cu diffuses into the coating and Sn diffuses into the Cu, creating CuSn intermetallics [10]: a film of the Cu 3 Sn intermetallic called Hphase, and on top of it a Cu 6 Sn 5 intermetallic with a grain structure, called K-phase. At room temperature the H-phase Cu 3 Sn remains limited to the Cu/coating interface, while the K-phase Cu 6 Sn 5 grows continuously through grain boundaries until the external surface of the coating is reached.…”