2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC) 2015
DOI: 10.1109/pvsc.2015.7356093
|View full text |Cite
|
Sign up to set email alerts
|

Internal strain analysis of CdTe thin films deposited by pulsed DC magnetron sputtering

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1

Citation Types

0
3
0

Year Published

2016
2016
2024
2024

Publication Types

Select...
4

Relationship

1
3

Authors

Journals

citations
Cited by 4 publications
(3 citation statements)
references
References 7 publications
0
3
0
Order By: Relevance
“…The voltage on the target is typically ≃800 V during the sputtering process although this value depends on the resistivity of the individual target used. The system is equipped with radiant heaters and the substrate temperature during deposition can be maintained at temperatures up to 250 ° C. This temperature and the use of relatively high working gas pressure with gas flows of 50 sccm has been found to minimize stress in the films [15].…”
Section: Methodsmentioning
confidence: 99%
“…The voltage on the target is typically ≃800 V during the sputtering process although this value depends on the resistivity of the individual target used. The system is equipped with radiant heaters and the substrate temperature during deposition can be maintained at temperatures up to 250 ° C. This temperature and the use of relatively high working gas pressure with gas flows of 50 sccm has been found to minimize stress in the films [15].…”
Section: Methodsmentioning
confidence: 99%
“…The advantages of the magnetron sputtering process are the uniformity of the deposited layer, the high thin film density and the relatively low substrate temperatures used during the growth of the device. The sputter deposition of CdTe solar cell requires substrate temperatures of ~250ºC [6]- [9],compared to 400ºC to 500ºC reported for VTD [10], [11].…”
Section: Introductionmentioning
confidence: 99%
“…The disadvantages of using RF power lie in the complex system design and the slow deposition rates [12]. Recently we reported on a new process for the magnetron sputtering of CdTe [9]. This uses a pulsed DC power supply which overcomes many of the limitations of using RF power.…”
Section: Introductionmentioning
confidence: 99%