2016
DOI: 10.1016/j.scriptamat.2016.04.034
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Interplay between bond breaking and plasticity during fracture at a nanomolecularly-modified metal-ceramic interface

Abstract: International audienceWe reveal the roles of moisture and temperature on the interplay between interfacial work of adhesion gamma(a) and metal plasticity gamma(p) for copper-silica interfaces modified with an organosilane nanolayer. We find that gamma(p) not equal 0 for interfaces with metal thicknesses h(cu) > 12 nm, and increases with ha, before it saturates at h(cu) similar to 165 nm. For a fixed h(cu), gamma(p) increases due to temperature-induced yield stress decrease despite a decrease in gamma(a) with t… Show more

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Cited by 6 publications
(11 citation statements)
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“…We prepared polymer-metal-MNL-ceramic structures sandwiched between two silica-capped Si(001) wafers for four-point-bend mechanical tests 19 (Fig. 1a ).…”
Section: Resultsmentioning
confidence: 99%
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“…We prepared polymer-metal-MNL-ceramic structures sandwiched between two silica-capped Si(001) wafers for four-point-bend mechanical tests 19 (Fig. 1a ).…”
Section: Resultsmentioning
confidence: 99%
“…Without breaking vacuum, we also deposited a 100-nm-thick Ta layer to facilitate metal-polymer bonding 17 . We glued the metal-MNL-silica structures to a dummy Si wafer with a System Three Resins ® T88 epoxy polymer to obtain beams comprised of layered Si-polymer-Ta-Cu-MPTMS-SiO 2 -Si structures for four-point-bend mechanical tests 19 (Fig. 1a ).…”
Section: Resultsmentioning
confidence: 99%
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