We report first-principles static and dynamic calculations that clarify the microscopic mechanism of carbon annihilation due to phosphorous treatment upon oxidation of silicon carbide (SiC). We identify the most stable form of the phosphorus (P) in the oxide as the four-fold coordinated with the dangling PO unit and find that the unit attracts carbon ejected from the interface, thus operating as a carbon absorber. This finding provides a microscopic reasoning for the first time for the promotion of the oxidation reaction on one hand and the annihilation of the C-related defects at the interface on the other. Secondary ion mass spectrometry measurements are also performed and the obtained carbon profile corroborates the theoretical finding above.
2The interface of a condensed matter and its oxidized film usually formed by the oxidation is ubiquitous in nature and provides an important stage in both science and technology. In semiconductor devices, for instance, the interface becomes a channel for the electric current and the band offset at the interface allows the gate controllability of the transistor action [1]. Hence the identification of the atomic structure and the clarification of its electronic functionality of the interface are challenging and demanded in nanoscience and technology.An example which has been insufficiently investigated in spite of its importance is the interface of silicon carbide (SiC) and silicon dioxide (SiO2). SiC is a candidate material for the sustainable power electronics in future due to its superior properties such as wide bandgap, high critical electric field and low intrinsic carrier concentration [2,3]. The additional but important advantage of SiC is that SiO2 films formed by the thermal oxidation can be used as gate insulating films in metal-oxide-semiconductor field effect transistors (MOSFETs) [3], ensuring the connectivity with the current Si technology.However, were carbon atoms not annihilated during the oxidation, the SiO2 films would not be realized. The fact is that, although SiC MOSFETs are fabricated, the mobility of the devices is lower than that of SiC bulk by two orders of magnitude [3]. This is certainly due to the interface state density, Dit, which is typically about 10 13 -10 14 cm -2 eV -1 [3,4,5] near the conduction-band edge (EC) of SiC which is higher by more than three orders of magnitude than that in typical SiO2/Si systems