Intrinsic stress in sputter-deposited thin films

Windischmann, H.

doi:10.1080/10408439208244586

Cited by 593 publications

(235 citation statements)

References 155 publications

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“…energetic ions can be used for this purpose since they can trigger surface and bulk diffusion processes, 1,102 induce changes in the film structure and chemical composition, 103 and cause generation of internal stresses. [104][105][106][107] The high fluxes of ionized material available in HiPIMS have been found to allow for control of the phase formation in both elemental and compound films. One example is the control of the phase composition in Ta films.…”

Section: B Phase Composition Tailoring By Hipimsmentioning

confidence: 99%

An introduction to thin film processing using high-power impulse magnetron sputtering

2012

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High-power impulse magnetron sputtering (HiPIMS) is a promising sputtering-based ionized physical vapor deposition technique and is already making its way to industrial applications. The major difference between HiPIMS and conventional magnetron sputtering processes is the mode of operation. In HiPIMS the power is applied to the magnetron (target) in unipolar pulses at a low duty factor (andlt;10%) and low frequency (andlt;10 kHz) leading to peak target power densities of the order of several kilowatts per square centimeter while keeping the average target power density low enough to avoid magnetron overheating and target melting. These conditions result in the generation of a highly dense plasma discharge, where a large fraction of the sputtered material is ionized and thereby providing new and added means for the synthesis of tailor-made thin films. In this review, the features distinguishing HiPIMS from other deposition methods will be addressed in detail along with how they influence the deposition conditions, such as the plasma parameters and the sputtered material, as well as the resulting thin film properties, such as microstructure, phase formation, and chemical composition. General trends will be established in conjunction to industrially relevant material systems to present this emerging technology to the interested reader.Funding Agencies|Swedish Research Council (VR)|623-2009-7348

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Section: B Phase Composition Tailoring By Hipimsmentioning

confidence: 99%

An introduction to thin film processing using high-power impulse magnetron sputtering

2012

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“…26 Such strain is sensitive to the grain size and film microstructure and both these properties are influenced by the growth conditions. There are additional factors present in sputtered films 27 . Of particular note is a process referred to as "shot peening", in which compressive strain arises as a result of the sample being bombarded by energetic particles during growth.…”

Section: A Sample Strainmentioning

confidence: 99%

Modification of electronic structure in compressively strained vanadium dioxide films

Huffman

Hollingshad

et al. 2015

Phys. Rev. B

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Vanadium dioxide (VO 2 ) undergoes a phase transition between an insulating monoclinic (M 1 ) phase and a conducting rutile phase. Like other correlated electron systems, the properties of VO 2 can be extremely sensitive to small changes in external parameters such as strain. In this work, we investigate a compressively strained VO 2 film grown on [001] quartz substrate in which the phase transition temperature (T c ) has been depressed to 325K from the bulk value of 340K. Infrared and optical spectroscopy reveals that the lattice dynamics of this strained film are very similar to unstrained VO 2 . However, some of the electronic inter-band transitions of the strained VO 2 film are significantly shifted in energy from those in unstrained VO 2 . That the lattice dynamics remain largely unchanged, while the T c and some of the electronic inter-band transitions differ substantially from the bulk values highlight the role of electronic correlations in driving this metal-insulator phase transition.

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“…There are numerous studies that consider the influence of bias voltage on the development of residual stresses [10,16,21,23]. These studies agree that the extra energy supplied by the application of the bias voltage to the species reaching the substrate provides them with enough mobility, not only to fill the gaps between columns and thus reduce the tensile stresses [23], but also to produce an "ionpeening" effect.…”

Section: Evolution Of Cracking Patternsmentioning

confidence: 61%

“…In this case, when contiguous columns are close enough, interatomic attractive forces act between the column walls which stretch the columns and thus tensile stresses develop inside them if the film is well adhered. This is the so-called grain boundary relaxation mechanism to explain the origin of tensile growth stresses [10,16,[21][22][23]. Furthermore, the low deposition temperature and relatively high deposition pressure of the present experiments were conditions that led to low energy, and thus low mobility, of the species arriving at the surface of the substrate.…”

Section: Evolution Of Cracking Patternsmentioning

confidence: 91%

“…In particular, the effect on the density of the films is of great importance for the performance of these films. The effect of bias voltage on film structure is well documented [18,19,21] and has been explained in terms of filling of voids in the film by positive ions arriving at the surface with high energy due to the strong attraction by the negatively biased substrate.…”

Section: Effect Of Bias Voltage: Series Cmentioning

confidence: 99%

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Structural and mechanical analysis for the optimization of PVD oxide coatings for protection against metal dusting

López

Salas

Melo-Máximo

et al. 2012

Applied Surface Science

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Intrinsic stress in sputter-deposited thin films

Cited by 593 publications

References 155 publications

An introduction to thin film processing using high-power impulse magnetron sputtering

An introduction to thin film processing using high-power impulse magnetron sputtering

Modification of electronic structure in compressively strained vanadium dioxide films

Structural and mechanical analysis for the optimization of PVD oxide coatings for protection against metal dusting

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