Intrinsically heat-sealable polyimide films with atomic oxygen resistance: Synthesis and characterization

Abstract

Intrinsically heat-sealable polyimides with atomic oxygen (AO) resistance (ARPIs) were synthesized from 2,3,3′,4′-oxydiphthalic anhydride (aODPA), 2,5-bis[(4-aminophenoxy)phenyl]diphenylphosphine oxide (BADPO), and para-phenylenediamine (PDA). The effects of the molecular structure and diamine ratio were investigated on the properties of the ARPI, including mechanical property, thermal property, heat sealability, and AO resistance. Heat sealability and AO resistance were realized for the ARPI film by combining the asymmetry of the aODPA moiety and the passivated layer forming characteristic of diphenylphosphine phosphine oxide group. Meanwhile, the deficiency of low mechanical strength and thermal resistance, commonly existing in a completely BADPO-derived polyimide system, was remedied effectively by the higher reactivity and rigidity of PDA.

Enhancement of atomic oxygen resistance for heat-sealable isomeric co-polyimide films by combining ether linkage with diphenylphosphine oxide

“…It was also found that CPI-0 has a lower AO erosion yield than Kapton HN, which was similar to PI (aODPA-PDA) and Kapton HN. 36 There are several steps involved in the AO exposure process for a polymer, including erosion initiation by oxygen atom-surface interaction, erosion propagation by chain scission, and material loss due to volatile removal. 45 Among the three steps, the first two are dominated by chemical interactions, and the last one by physical interaction such as AO collisions with the volatile species.…”

“…In our previous work, AO resistance was realized for the aODPA-( para -phenylenediamine) (PDA) system by introducing DPO comonomer. 36 This work is aimed at developing heat-sealable polyimide films with enhanced AO resistance and mechanical strength for aerospace applications. These polyimides were prepared via copolymerizing 4,4′-oxydianiline (ODA), BADPO and aODPA.…”

Colorless and transparent semi‐alicyclic polyimide films with intrinsic flame retardancy based on alicyclic dianhydrides and aromatic phosphorous‐containing diamine: Preparation and properties

“…For comparison, two PI references, including PI‐ref‐a (HPMDA‐ODA) and PI‐ref‐b (HBPDA‐ODA) were also prepared via the similar procedure. The phosphorus‐containing diamine, BADPO was developed in our laboratory and mass‐produced for the research and development of functional PI films, such as the PI films with excellent atomic oxygen resistance, 31,32 with good heat‐processability, 33 and so on. Actually, phosphorus‐containing diamines have been well used as highly‐efficient FRs for the common combustible polymers, such as epoxy 34 due to the flame retardant functionality of phosphorus components both in gas phase and condensed phase 35 .…”

Synthesis and characterization of melt‐processable polyimides derived from diaminodiphenylsulfone and benzophenone tetracarboxylic dianhydride with excellent heat resistance and thermoplasticity

“…It is well known that via adding a third monomer containing flexible segments, bulky groups and non-coplanar structures during copolymerization, these structures can be incorporated into the molecular chain of polyimides, thereby effectively improving their solubility and processability. [19][20][21][22][23] In the late 1970s, the Langley Research Center of NASA introduced thermoplastic polyimide under the name ''LARC-TPI''. 24,25 Since then, thermoplastic polyimides have attracted extensive research attention.…”

“…To overcome these problems, different structural modifications were carried out to improve the solubility and processing characteristics of aromatic polyimides. It is well known that via adding a third monomer containing flexible segments, bulky groups and non‐coplanar structures during copolymerization, these structures can be incorporated into the molecular chain of polyimides, thereby effectively improving their solubility and processability 19–23 . In the late 1970s, the Langley Research Center of NASA introduced thermoplastic polyimide under the name ''LARC‐TPI'' 24,25 .…”