Flat Panel Display Manufacturing 2018
DOI: 10.1002/9781119161387.ch1
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Cited by 2 publications
(3 citation statements)
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“…Among them, thin film encapsulation (TFE) technology has emerged as the most promising choice due to its excellent permeation rate and flexibility. Studies on TFE techniques involve sputter-coating, IJP, CVD and ALD [46,[200][201][202][203][204]. Recent studies on TFE have been predominantly focused on a hybrid approach that involves an inorganic/organic multiplayer stack.…”
Section: Encapsulation Layermentioning
confidence: 99%
See 1 more Smart Citation
“…Among them, thin film encapsulation (TFE) technology has emerged as the most promising choice due to its excellent permeation rate and flexibility. Studies on TFE techniques involve sputter-coating, IJP, CVD and ALD [46,[200][201][202][203][204]. Recent studies on TFE have been predominantly focused on a hybrid approach that involves an inorganic/organic multiplayer stack.…”
Section: Encapsulation Layermentioning
confidence: 99%
“…Currently, AMOLED displays are manufactured on mid to large generation (Gen) glass and flexible substrates [43][44][45]. The enormous manufacturing volume reduces the cost by leveraging economies of scale; however, the highly complex manufacturing processes adopted from the semiconductor manufacturing process-photolithography patterning, vacuum deposition (including both PVD and chemical vapor deposition (CVD)) and etchingdrive up the capital costs required for AMOLED panel production [46]. As the returns from further scaleup either on larger substrate size or higher volume diminishes, the next step for cutting production costs will require manufacturing of AMOLED panels with less expensive processes.…”
Section: Introductionmentioning
confidence: 99%
“…Meanwhile, the United States Environmental Protection Agency identified the GHG emissions from semiconductor device manufacturing to be one of the foremost challenges for climate change . One sector of electronics that is of particular impact is flat panel displays, which rely on low-temperature polysilicon and metal-oxide (known as LTPO) semiconductor thin-film transistors (TFTs) for their backplane electronics. These TFTs require extensive use of polyfluorinated chemicals and vacuum-based processing in their manufacture, with energy requirements for operating the fabs that has increased by orders of magnitude in the last 30 years .…”
mentioning
confidence: 99%