Introduction of a novel electric field-based plate heat sink for heat transfer enhancement of thermal systems

Abstract

Purpose The purpose of this study is to use an electric field technique to design novel heat sinks capable of rejecting as much heat as possible in a limited space. Configuration of electrodes in this study can be used for increasing the efficiency of heat sinks. Design/methodology/approach This study investigates a novel electrohydrodynamic (EHD)-based heat sink for thermal management of electronic devices and thermal systems. The significant part of designing an EHD heat sink is the arrangement of the electrodes. A numerical simulation is performed for a heat sink with two parallel plates to determine the optimum dimensional configuration of electrodes. The upper plate of this heat sink is the ground electrode with a constant atmosphere temperature, and the lower plate of it with flush-mounted high-voltage electrodes has uniform heat flux. Findings The results show that heat transfer changes by the size of the vortices and the number of them. These vortices are emerged by the electric field, and the number of them increases with increasing the number of electrodes. The interaction of vortices size and number leads to having the lowest average temperature in the optimum case by two high voltage electrodes with widths of 7.5 mm and a 17.5 mm gap between them. In comparison with the case without the electric field, with increasing the applied voltage to 30 kV, the efficiency of this EHD heat sink increases up to 37%. Originality/value Improvements in electrical equipment make them more compact with higher heat fluxes. Hence, the amount of heat to be dissipated per area increases and needs thermal management to operate at their design temperatures. Therefore, to improve the performance and life span of electronic components and increase their efficiency, it is necessary to design heat sinks to decrease their maximum (peak) temperature.

Thermal Conductivity and Dynamic Viscosity of Highly Mineralized Water

“…where g W P s ; T; c ð Þ is the coefficient of dynamic viscosity of the solution (μPa•s) at pressure P, MPa, temperature T, K and concentration c, wt.%; g E P s ; T; c ð Þ-the viscosity of the solution near the saturation line at T and c; q W P; T ð Þ, g W P; T ð Þ-density and viscosity of pure water at P and T; q W P S ; T ð Þ, g W P s ; T ð Þ are the density and viscosity of water near the saturation line at P s and T; P s is the pressure at the saturation line; c = P i¼1 c i , wt.%, where c i is the concentration of the i-th system; P 1 =1 MPa; T 1 = 1 K. Note: The calculated values of the dynamic viscosity of pure water according to formula (9) are consistent industrial standard [10] and the recommended reference data [11] in the temperature range of 348-473 K and pressures of 0.1-100 MPa within 1%, and in the temperature range of 348-473 K and pressures of 100-300 MPa within 1.5%. According to formula (8), the values of the dynamic viscosity of various water-salt systems were obtained in the temperature range of 333-473 K, pressures of 0.1-100 MPa, and concentrations of 0-25 wt.%.…”

“…It increases the nominal power, reduce the dimensions and consumables in equipment as coolant. Studies on nanofillers show that increasing the thermal conductivity of nanofluids depends on many variables [9][10][11][12]. These factors include nano-filler size, particle surface shape and area, filler volume, particle aggregation, stability, viscosity, brown motion and temperature effect.…”

Optimization of the Cooling System of Electric Vehicle Batteries

“…When φ is replaced by its approximate value, the expressions in parentheses are no longer zero. The integral expression (10) makes it possible to select n independent linear functions for w and to obtain n equations for the coefficients C_ 1 .C_2 .C_3… It should be noted that the weighted integral expression of any differential equation is available. In general, the weight function w in the integral expression is under weaker continuity conditions than the dependent variable φ.…”

“…1. The ports in the main structure of this article carry the cooled water into the paths designed in the shell of parts and this method seems to be much more effective in reducing the temperature [10]. Liquid cooling is a huge achievement in the computing power of parts.…”

Optimizing Fluid Flow Cooling in Gas Transmission Systems

“…Gas booster stations, as their name implies, will compensate for these pressure drops along the way. In addition, gas is a compressible material, and its volume can be reduced by increasing the pressure, and as a result, a larger volume of gas can be transferred under standard conditions [1,2].…”