Flexible Glass 2017
DOI: 10.1002/9781118946404.ch1
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Introduction to Flexible Glass Substrates

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Cited by 12 publications
(7 citation statements)
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“…We tested our slot-die coating method on the R2R printing of perovskite on a 20 m long, 100 μm thick flexible Corning Willow Glass substrate. Indium zinc oxide (IZO) is R2R sputtered on the Willow Glass, as reported elsewhere, and general properties of flexible glass and device fabrication techniques utilizing it have likewise been reported. , It was shown previously that flexible PSCs with IZO as the transparent conductive oxide have achieved over 18% PCE . After R2R IZO coating, SnO 2 is slot-die R2R-coated from Sn­(OCH­(CH 3 ) 2 ) 4 in isopropanol (IPA) solution .…”
mentioning
confidence: 89%
“…We tested our slot-die coating method on the R2R printing of perovskite on a 20 m long, 100 μm thick flexible Corning Willow Glass substrate. Indium zinc oxide (IZO) is R2R sputtered on the Willow Glass, as reported elsewhere, and general properties of flexible glass and device fabrication techniques utilizing it have likewise been reported. , It was shown previously that flexible PSCs with IZO as the transparent conductive oxide have achieved over 18% PCE . After R2R IZO coating, SnO 2 is slot-die R2R-coated from Sn­(OCH­(CH 3 ) 2 ) 4 in isopropanol (IPA) solution .…”
mentioning
confidence: 89%
“…[29,74,75,[79][80][81][82] Flexible glass has drawn attention as an alternative substrate for PSCs because it can withstand temperatures of up to 600 C, WVTR is below 3 Â 10 À7 g m À2 day À1 , and is compatible with R2R processing system. [83] Willow flexible glass substrates were used to produce f-PSCs using the blade-coating method and an air-blowing technique to control the crystallization process. The f-PSCs showed PCEs of 19.72% and 15.86% for a small area and a module of 42.9 cm 2 , respectively.…”
Section: Substratesmentioning
confidence: 99%
“…Glass substrates are widely used for encapsulations and considered the norm for evaluating alternative encapsulation methods. , The reduction of glass thickness and fabrication of flexible glass preserves the barrier properties of the glass since the fabrication process of normal and flexible glass is similar and both of them are made of molten glass that prevents the formation of pinhole defects . Although adhesives and glass frit bonding can be used for sealing the glass in the encapsulation process, there are still limitations in hermetically encapsulating devices using normal and flexible glass, such as edge sealing …”
Section: Durability Of Optoelectronic Devicesmentioning
confidence: 99%
“…Recent demands for lighter weight and flexibility for flexible optoelectronic applications have led to research into thinner glass. This not only helps reduce the overall weight of the device but may also enable flexibility as the bending stiffness is proportional to the thickness of the material to the third power …”
Section: Introductionmentioning
confidence: 99%