Introduction to surface-mount technology

Illés, Béla; Krammer, Olivér; Géczy, Attila

doi:10.1016/b978-0-12-818505-6.00001-7

Cited by 3 publications

(3 citation statements)

References 47 publications

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“…, 2008). Most of the newly developed microcomponents are designed for surface mounting on printed circuit boards (PCBs) using surface mount technology (Prasad, 1997) (Illés et al. , 2020).…”

Section: Introductionmentioning

confidence: 99%

Simplifying finite elements analysis of four-point bending tests for flip chip microcomponents

Mecellem,

Belhenini,

Khelladi

et al. 2024

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Purpose The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly. Design/methodology/approach In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison. Findings The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results. Originality/value This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.

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Section: Introductionmentioning

confidence: 99%

Simplifying finite elements analysis of four-point bending tests for flip chip microcomponents

Mecellem,

Belhenini,

Khelladi

et al. 2024

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“…As a result, using small-size passive chip components in electronic packaging became necessary, especially in consumer electronic products (Najib et al, 2018). SMT made it possible to fit several small electronic components such as capacitors and resistors on a compact PCB (Gengenbach et al, 2020;Illés et al, 2020).…”

Section: Introductionmentioning

confidence: 99%

Parameter optimization for surface mounter using a self-alignment prediction model

Mistry

Gupta

Jain

et al. 2022

SSMT

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Purpose The purpose of this paper is to develop a machine learning model that predicts the component self-alignment offsets along the length and width of the component and in the angular direction. To find the best performing model, various algorithms like random forest regressor (RFR), support vector regressor (SVR), neural networks (NN), gradient boost (GB) and K-nearest neighbors (KNN) were performed and analyzed. The models were implemented using input features, which can be categorized as solder paste volume, paste-pad offset, component-pad offset, angular offset and orientation. Design/methodology/approach Surface-mount technology (SMT) is the technology behind the production of printed circuit boards, which is used in several types of commercial equipment such as communication devices, home appliances, medical imaging systems and sensors. In SMT, components undergo movement known as self-alignment during the reflow process. Although self-alignment is used to decrease the misalignment, it may not work for smaller size chipsets. If the solder paste depositions are not well-aligned, the self-alignment might deteriorate the final alignment of the component. Findings It were trained on their targets. Results obtained by each method for each target variable were compared to find the algorithm that gives the best performance. It was found that RFR gives the best performance in case of predicting offsets along the length and width of the component, whereas SVR does so in case of predicting offsets in the angular direction. The scope of this study can be extended to developing this model further to predict defects that can occur during the reflow process. It could also be developed to be used for optimizing the placement process in SMT. Originality/value This paper proposes a predictive model that predicts the component self-alignment offsets along the length and width of component and in the angular direction. To find the best performing model, various algorithms like RFR, SVR, NN, GB and KNN were performed and analyzed for predicting the component self-alignment offsets. This helps to achieve the following research objectives: best machine learning model for prediction of component self-alignment offsets. This model can be used to optimize the mounting process in SMT, which reduces occurrences of defects and making the process more efficient.

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“…Electronic items are continuously innovating and becoming more complex as time passes; concurrently, they are becoming more intelligent and more compact [1]. This breakthrough should be supported by improvements in manufacturing of electronic component.…”

Section: Introductionmentioning

confidence: 99%

Numerical Study on the Effect of Different Viscometer Test on Stencil Printing Process

Ishak,

Rusdi,

Abdullah

et al. 2022

Jurnal Teknologi

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Using CFD simulation, this study analyses the applicability of several spindle types for assessing lead-free solder paste. The purpose of this investigation is to determine how much solder paste applied on the solder pad. Five separate studies were conducted on parallel-plate (PP) and cone-plate (CP) spindles. The simulation was performed by using the Volume of Fluid (VOF) approach, and the Cross model represented solder paste viscosity. Since it is popularly used in modern industry, lead-free solder paste SAC305 type 3 was chosen for this study. Regardless of squeegee speed or aperture size, solder paste always filled the volume. The PP with 0.5 mm gap exhibits the smallest average disparity between simulation and experiment for all squeegee speeds tested. For 1⁰ CP, all experiments show similar trend line with average disparity except for 0.5 mm PP. All tests with very small aperture volumes produced comparable filled volume values, except for 0.5 mm PP test, which showed the smallest percentage change when the experimental data is compared at higher aperture volumes. This method can be used by other simulation researchers to get solder paste’s viscosity data for their solder paste simulation.

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Introduction to surface-mount technology

Cited by 3 publications

References 47 publications

Simplifying finite elements analysis of four-point bending tests for flip chip microcomponents

Simplifying finite elements analysis of four-point bending tests for flip chip microcomponents

Parameter optimization for surface mounter using a self-alignment prediction model

Numerical Study on the Effect of Different Viscometer Test on Stencil Printing Process

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