Introductory Chapter: Electronics Cooling — An Overview

Murshed, S. M. Sohel

doi:10.5772/63321

Cited by 19 publications

(17 citation statements)

References 39 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…There are a few important factors in designing products such as materials, internal connection technologies, mechanical elements, thermal management, ergonomics, and green technologies. Modifications that involve notable sophisticated design with extremely small component size and densely populated circuit boards will increase the temperature in each component and the power density during system operation 3 . The required product design and functional demand for power applications add to the challenge in the thermal management of devices.…”

Section: Thermal Managementmentioning

confidence: 99%

“…The principle involved when voltage is directly applied to TEC and heat is conducted in materials. The sustainability of this type of active management is higher compared with those of other types, although the efficiency of TECs is lower 3,12 . Furthermore, the flow of heat will eventually tolerate the flow of current 16,17 .…”

Section: Thermal Managementmentioning

confidence: 99%

“…Therefore, the area will give lower thermal conductivity due to the resistance for heat flow in the void spaces 41 . Many researchers nowadays focused on the enhancement materials properties, surface contact, and materials bond formation to have good thermal performance and heat dissipation 3,42‐44 . Thermal resistance measurement usually conducted using the laser flash method, simulation studies, temperature measurement, and others 45‐47 .…”

Section: Thermal Managementmentioning

confidence: 99%

“…Extensive efforts have been exerted in the development of TIMs with considerable design modification for safe mode, energy-efficient, and low-cost preparation and operations. 3 Most researchers focus on design improvement due to the motivation toward the industrial revolution for electronic machine-related smart systems. The existing targets for electronic devices include wearability, easy handling, user-friendliness for the public, and reduced size.…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

A review of thermal interface material fabrication method toward enhancing heat dissipation

et al. 2020

View full text Add to dashboard Cite

Summary Thermal interface materials (TIMs) are applied in electronic devices that are involved in heat generation and raising the temperature. The optimization of TIMs is important in heat dissipation to maintain the good performance of devices, low power during operation, and reduced internal damages among small components. The TIMs are inserted between two contact surfaces to enhance thermal conductivity that will reduce the increment of surface temperature in a longer time and facilitates the cooling process with a consistent power supplied to the system with minimum increment. Research on nanomaterials and hybrid materials aims to obtain maximum thermal conductivity and reduce resistance in the devices. However, the suitable fabrication method for achieving good production and performance is still debatable. Therefore, significant fabrication methods have been explored for various materials. This review provides insights into the current work focusing on the materials used in the development of TIMs by various methods. The discussion begins with the introduction of thermal management and the working principles applied in the system. Then, the methods applied for material fabrication into TIMs, including the advantages and disadvantages of the methods, are discussed. Last, the current challenges and opportunities in methods used are discussed to offer new inputs and improvement in method modification for TIMs design. The targeted thermal performance for the industrial market of TIMs for nanomaterial applications is approximately 100 W/mK and 1 × 10−6 m2/WK with lowest power of 100 W.

show abstract

Section: Thermal Managementmentioning

confidence: 99%

Section: Thermal Managementmentioning

confidence: 99%

Section: Thermal Managementmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

A review of thermal interface material fabrication method toward enhancing heat dissipation

et al. 2020

View full text Add to dashboard Cite

show abstract

“…Active thermal management generally includes types of forced air (fan or blower), forced liquid (cold plates), and solid‐state heat pumps (thermoelectric coolers). However, active thermal management generates audible noise during operation and provides more complex and costly designs than those of passive systems . Meanwhile, passive thermal management involves heat spreaders, heat pipes, and thermal interface materials (TIMs) because it is inexpensive and simple to implement because of minimal equipments …”

Section: Introductionmentioning

confidence: 99%

Enhancement of thermal interface material properties using carbon nanotubes through simple electrophoretic deposition method

Bahru

Mohamed

2020

Int J Energy Res

View full text Add to dashboard Cite

The industrial revolution development of electronic technologies has turned the electronic system into a complicated integration of high-power density and smart design. The complex integrated design has contributed to the excessive heat generation in electronic devices. Consequently, heat management devices have become crucial in prolonging the lives of devices and components and maintaining their optimal performance. Therefore, the passive heat management treatment through thermal interface materials (TIMs) in the devices is among the best options to remove heat from electronic devices. Carbon nanotubes (CNTs) with high-thermal conductivity was employed in this study for TIM development by using the simple electrophoretic deposition (EPD) method. The CNTs were synthesized and purified before TIM development. Several analyses, including transmission electron microscopy, thermogravimetric analysis, Raman spectroscopy, and Fourier-transform infrared, were conducted. Analysis results showed that only 0.03 wt% was retained and carbon content increased up to 97.84% after purification. The purified CNTs were dissolved in a suspension medium with a ratio of 0.5 mg/mL to achieve suspension stability, and a Zetasizer was used for verification. The following three operating parameters of EPD were investigated: (a) range of applied voltage (100-200 V), (b) deposition time (1-20 min), and (c) gap between electrodes (10-20 mm). On the basis of the characterization results, the optimum process condition of EPD was achieved at 175 V, 10 minutes, and 10 mm with 1.6 mg of CNT deposition and 14.14 μm of CNT thickness. The maximum thickness of deposited CNTs was 56.95 μm, producing 27.08 W/mÁK and 2.09 mm 2 /s of thermal conductivity and diffusivity, respectively. These results indicate the high potential of CNTs in facilitating efficient heat removal in TIM fabrication. K E Y W O R D Scarbon nanotubes, electrophoretic deposition, heat spreader, thermal interface materials

show abstract

Numerical Investigation of Laminar Convective Heat Transfer of Nanofluid in Parallel Cooling Channels

Haryoko

Sasmito

Kurnia

2022

Lecture Notes in Mechanical Engineering

View full text Add to dashboard Cite

Introductory Chapter: Electronics Cooling — An Overview

Cited by 19 publications

References 39 publications

A review of thermal interface material fabrication method toward enhancing heat dissipation

A review of thermal interface material fabrication method toward enhancing heat dissipation

Enhancement of thermal interface material properties using carbon nanotubes through simple electrophoretic deposition method

Numerical Investigation of Laminar Convective Heat Transfer of Nanofluid in Parallel Cooling Channels

Contact Info

Product

Resources

About