Inverted pyramid structure on monocrystalline silicon processed by wet etching after femtosecond laser machining in air and deionized water

Wang, Qingwei; Yao, Peng; Li, Yueming; Jiang, Long; Xu, Jimiao; Liang, Shuang; Chu, Dongkai; He, Weidong; Huang, Chuanzhen; Zhu, Hongbo; Liu, Hanlian

doi:10.1016/j.optlastec.2022.108647

Cited by 16 publications

(7 citation statements)

References 34 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In terms of femtosecond-laser-assisted wet etching, other process methods can also be introduced. In order to achieve efficient and high-quality processing, silicon can be processed using a femtosecond laser in air and deionized water, respectively, followed by wet etching, which can improve the optical properties of silicon [111]. A Bessel beam femtosecond laser can be used to assist in wet etching to prepare small taper, large depth, and high aspect ratio structures [112].…”

Section: Laser-electrochemical Composite Processing Technologymentioning

confidence: 99%

A Review of Femtosecond Laser Processing of Silicon Carbide

Wang,

Zhang,

Chen

et al. 2024

Micromachines

View full text Add to dashboard Cite

Silicon carbide (SiC) is a promising semiconductor material as well as a challenging material to machine, owing to its unique characteristics including high hardness, superior thermal conductivity, and chemical inertness. The ultrafast nature of femtosecond lasers enables precise and controlled material removal and modification, making them ideal for SiC processing. In this review, we aim to provide an overview of the process properties, progress, and applications by discussing the various methodologies involved in femtosecond laser processing of SiC. These methodologies encompass direct processing, composite processing, modification of the processing environment, beam shaping, etc. In addition, we have explored the myriad applications that arise from applying femtosecond laser processing to SiC. Furthermore, we highlight recent advancements, challenges, and future prospects in the field. This review provides as an important direction for exploring the progress of femtosecond laser micro/nano processing, in order to discuss the diversity of processes used for manufacturing SiC devices.

show abstract

Section: Laser-electrochemical Composite Processing Technologymentioning

confidence: 99%

A Review of Femtosecond Laser Processing of Silicon Carbide

Wang,

Zhang,

Chen

et al. 2024

Micromachines

View full text Add to dashboard Cite

show abstract

“…It can be used for the micromachining of brittle materials with high hardness. Additionally, femtosecond laser processing technology is able to efficiently fabricate patterned surfaces such as microporous structures, inverted pyramids, micro-and nano-cylindrical structures, and micrometer slot array structures on the centimeter scale [9,10]. However, the femtosecond laser processing of microstructures still has some drawbacks, such as debris deposition and large surface roughness after processing [11,12].…”

Section: Introductionmentioning

confidence: 99%

Wide-Spectrum Antireflective Properties of Germanium by Femtosecond Laser Raster-Type In Situ Repetitive Direct Writing Technique

Wang,

Zhang,

Chen

et al. 2024

Coatings

View full text Add to dashboard Cite

A femtosecond laser raster-type in situ repetitive direct writing technique was used for the fabrication of anti-reflective microhole structures in Germanium (Ge) in the visible near-infrared range (300–1800 nm). This technique builds a layer of microstructured arrays on the surface of Ge, enabling Ge to exhibit excellent anti-reflective properties. The large-area micro-nanostructures of Ge were fabricated using femtosecond laser raster-type in situ repetitive direct writing. Ge microstructures are characterized by their structural regularity, high processing efficiency, high reproducibility, and excellent anti-reflective properties. Experimental test results showed that the average reflectance of the Ge microporous structure surface in the range of 300–1800 nm was 2.25% (the average reflectance of flat Ge was 41.5%), and the lowest reflectance was ~1.6%. This microstructure fabrication drastically reduced the optical loss of Ge, thus enhancing the photothermal utilization of Ge. The many nanoburrs and voids in the Ge microporous structure provided excellent hydrophobicity, with a hydrophobicity angle of up to 133 ± 2° (the hydrophobicity angle of flat Ge was 70 ± 2°). The high hydrophobicity angle allows for strong and effective self-cleaning performance. The femtosecond laser raster-type in situ repeatable direct writing technology has many desirable properties, including simplicity, high accuracy, flexibility, and repeatability, that make it one of the preferred choices for advanced manufacturing. The Ge micro-nanostructured arrays with excellent optical anti-reflective properties and hydrophobicity have become an attractive alternative to the current photo-thermal absorbers. It is expected to be used in many applications such as solar panels, photovoltaic sensors, and other optoelectronic devices.

show abstract

“…The optical functional surfaces of these components are composed of micro-triangular pyramid arrays (MTPAs) with edge lengths less than 100 µm. At present, the primary MTPA manufacturing methods include laser-induced etching [1], chemical etching [2], electrical discharge forming machining [3], and mechanical machining [4,5]. Among these, laser-induced etching and chemical etching have produced good results during the processing of silicon-based materials, though they are rarely used to process plastic metals, such as copper and aluminum [1].…”

Section: Introductionmentioning

confidence: 99%

“…At present, the primary MTPA manufacturing methods include laser-induced etching [1], chemical etching [2], electrical discharge forming machining [3], and mechanical machining [4,5]. Among these, laser-induced etching and chemical etching have produced good results during the processing of silicon-based materials, though they are rarely used to process plastic metals, such as copper and aluminum [1]. Electrical discharge forming machining can be used to process brittle and hard metals; however, copper electrodes must be prepared in advance, and this is carried out by mechanical machining [6].…”

Section: Introductionmentioning

confidence: 99%

Fly-Cutting Processing of Micro-Triangular Pyramid Arrays and Synchronous Micro-Scrap Removal

Gao,

Xu,

Lei

et al. 2024

Micromachines

View full text Add to dashboard Cite

Many micro-scraps are generated when a micro-triangular pyramid array (MTPA) is machined by the fly-cutting method. Micro-scraps are generally not removed quickly enough; therefore, these residual micro-scraps participate in the cutting process again, scratching the workpiece surface and accelerating diamond tool wear. To remove micro-scraps rapidly, a fly-cutting method to produce MTPAs on vertically oriented working surfaces was developed during this study. The results show that an MTPA produced by fly cutting on a vertical workpiece had a clearly outlined structure, high dimensional accuracy, and a low surface roughness. There was no micro-scrap residue on the workpiece surface and the diamond tool wear was small. The cutting inlet edges had no burrs, and the cutting outlet edges had only a small number of burrs. This method of fly cutting MTPAs on vertically oriented working surfaces provides a foundation for the development of high-precision micro-triangular pyramid optical elements.

show abstract

Inverted pyramid structure on monocrystalline silicon processed by wet etching after femtosecond laser machining in air and deionized water

Cited by 16 publications

References 34 publications

A Review of Femtosecond Laser Processing of Silicon Carbide

A Review of Femtosecond Laser Processing of Silicon Carbide

Wide-Spectrum Antireflective Properties of Germanium by Femtosecond Laser Raster-Type In Situ Repetitive Direct Writing Technique

Fly-Cutting Processing of Micro-Triangular Pyramid Arrays and Synchronous Micro-Scrap Removal

Contact Info

Product

Resources

About