Investigating ESD sensitivity in electrostatic SiGe MEMS

Sangameswaran, Sandeep; Coster, J. De; Linten, Dimitri; Scholz, Mirko; Thijs, S.; Groeseneken, G.; Wolf, Ingrid De

doi:10.1088/0960-1317/20/5/055005

Cited by 10 publications

(5 citation statements)

References 11 publications

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“…As the amplitude of the beam) is increased, the electrostatic force bet and pulls the beam down. As expected, scan points 2 and 3, which are towards the centre of the beam show a higher displacement than points 1 and 4 which are closer to the clamping points [6]. Moreover, the displacement is symmetric with respect to the voltage polarity and is very repeatable for large number of actuation cycles which point towards a well From these results it can be concluded that the not harm the functionality of these MEMS devices.…”

Section: Mems Characterizationsupporting

confidence: 75%

A Detailed Study of a Novel Wafer Separation Method for Surface Sensitive MEMS Wafers

et al. 2012

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Abrasive blade dicing is the most common technique for die separation. In this work an alternative dry and non-abrasive die separation method, which is known as "Stealth dicing", is assessed for surface-sensitive MEMS (Micro Electro Mechanical Systems) wafers. The dicing performance and capability of the system is investigated on 200mm full thickness wafers with and without MEMS structures. The diced wafers are analyzed with respect to the silicon cutting quality, possible particle contamination, the condition of functional structures and their mechanical and electrical functionality. In addition the performance and limitations of two different Stealth Dicing Engine (SDE) types, SDE01 and SDE03, are compared to each other with respect to their performance on MEMS wafer dicing.From this work design rules and proper dimensions of the scribe line can be determined. Process integration solutions, describing steps before and after the Stealth dicing process, including the contact-less dicing tape application to the wafer back side and the final die separation method by tape stretching, are presented. It was also found that the SDE03 laser with its outstanding performance in terms of process speed and separation quality can bring a breakthrough for applying this technology for MEMS wafers.

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Section: Mems Characterizationsupporting

confidence: 75%

A Detailed Study of a Novel Wafer Separation Method for Surface Sensitive MEMS Wafers

et al. 2012

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“…Other models like the Machine Model (MM) are also used to model events where machine parts act as the discharge source. Due to the usually large resistance of electrostatic MEMS, the results of tests with the MM and the HBM are very similar 1 .…”

Section: Transient Behaviour Of Mems Tunable Gratings During Esd Eventsmentioning

confidence: 95%

“…Reliability estimation of MEMS devices has been mainly done thorough extensive Electrostatic discharge (ESD) tests 1,2 , shock and vibration tests 3,4 , fatigue and creep tests 5,6 , and aging tests through rapid thermal cycling. These tests have so far mainly been used to qualify devices.…”

Section: Introductionmentioning

confidence: 99%

“…While ESD failures are mostly dominated by the breakdown of materials, especially various oxides, in the case of semiconductor devices, in MEMS devices a number of other possible failure mechanisms such as stiction and micro-welding can be found. So far ESD testing has mainly been used to obtain the statistics of failed devices, after the end of the ESD event, and to estimate the effects of failure 1,2 ; to date, only few transient behavior studies have been reported, e.g. the dynamics of a RF MEMS switch during ESD failure has been tracked using a Laser Scanning Vibrometer (LSV) 10 .…”

Section: Introductionmentioning

confidence: 99%

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ESD testing and combdrive snap-in in a MEMS tunable grating under shock and vibration

et al. 2011

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This work describes a method for tracking the dynamics of electrostatic discharge (ESD) sensitive MEMS structures during ESD events, as well as a model for determining the reduced combdrive snap-in voltage under vibration and shock. We describe our ESD test setup, based on the human body model, and optimized for high impedance devices. A brief description of the MEMS tunable grating, the test structure used here, and its operation is followed by results of the measured complex device dynamics during ESD events. The device fails at a voltage up to four times higher than that required to bring the parts into contact. We then present a model for the snap-in of combfingers under shock and vibration. We combine the results of the analytical model for combdrive snap-in developed here with a shock response model to compute the critical shock acceleration conditions that can result in combdrive snap-in as a function of the operating voltage. We discuss the validity regimes for the combdrive snap-in model and show how restricting the operation voltage below the snap-in voltage is not a sufficient criterion to ensure reliable operation especially in environments with large disturbances.

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“…We attributed this malfunction to some repeated impact of electrostatic discharge on the MEMS conductive elements. 21 The MEMS scanning mirror was replaced by the manufacturer and the system was calibrated to its original scan rate and range. To be included in the study, four through twelve-year-old children had to have at least one primary tooth restored with a resin composite.…”

Section: Human Subjectsmentioning

confidence: 99%

Clinical cross-polarization optical coherence tomography assessment of subsurface enamel below dental resin composite restorations

et al. 2014

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Abstract. A newly designed intraoral swept source cross-polarization optical coherence tomography (CP-OCT) imaging system was used to examine the integrity of the subsurface enamel below resin composite restorations placed in primary teeth. CP-OCT analysis was performed using images obtained from resin composite restoration in 62 (n ¼ 62) pediatric subjects. Clinical examination was performed by a single examiner prior to CP-OCT imaging and analysis. CP-OCT images are presented using a unique combined intensity image, where a false color scale is overlaid on the grayscale intensity image. There was a clear difference in the distribution of the mean-backscattered intensity (mR) between restorations recently placed and those possessing frank cavitation (Student's t-test, P < 0.0001). For mR above 15.49 dB, the sensitivity was 80% and specificity 86%. The Youden index J was 0.8 above 12.3 dB where sensitivity was 100% and specificity was 80%. CP-OCT imaging may be used to confirm the subsurface marginal integrity below resin composite restorations but with careful consideration of limitations of the imaging modality. CP-OCT imaging may be a useful adjunct to clinical visual investigation to confirm that a composite margin has a sound and well-adapted interface.

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Investigating ESD sensitivity in electrostatic SiGe MEMS

Cited by 10 publications

References 11 publications

A Detailed Study of a Novel Wafer Separation Method for Surface Sensitive MEMS Wafers

A Detailed Study of a Novel Wafer Separation Method for Surface Sensitive MEMS Wafers

ESD testing and combdrive snap-in in a MEMS tunable grating under shock and vibration

Clinical cross-polarization optical coherence tomography assessment of subsurface enamel below dental resin composite restorations

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