Investigating on Through Glass via Based RF Passives for 3-D Integration

Qian, Libo; Sang, Jifei; Xia, Yinshui; Wang, Jian; Zhao, Peiyi

doi:10.1109/jeds.2018.2849393

Cited by 33 publications

(9 citation statements)

References 16 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…It can be inferred that for a given coupling between the repeating coils, as the Q factor of the coils increases, the power transmission efficiency increases. To achieve high power transmission efficiency for a high operating range, high Q-factor repeating coils are required [11] . Fig.…”

Section: Pssp Type Four-coil Resonant Networkmentioning

confidence: 99%

Wireless communication and wireless power transfer system for implantable medical device

Zhang¹,

Chen²,

Fei³

et al. 2020

J. Semicond.

View full text Add to dashboard Cite

Traditional magnetically coupled resonant wireless power transfer technology uses fixed distances between coils for research, to prevent fluctuations in the receiving voltage, and lead to reduce transmission efficiency. This paper proposes a closed-loop control wireless communication wireless power transfer system with a wearable four-coil structure to stabilize the receiving voltage fluctuation caused by changes in the displacement between the coils. Test results show that the system can provide stable receiving voltage, no matter how the distance between the transmitting coil and the receiving coil is changed. When the transmission distance is 20 mm, the power transfer efficiency of the system can reach 18.5% under the open-loop state, and the stimulus parameters such as the stimulation period and pulse width can be adjusted in real time through the personal computer terminal.

show abstract

Section: Pssp Type Four-coil Resonant Networkmentioning

confidence: 99%

Wireless communication and wireless power transfer system for implantable medical device

Zhang¹,

Chen²,

Fei³

et al. 2020

J. Semicond.

View full text Add to dashboard Cite

show abstract

“…Fortunately, Through-Silicon Via (TSV) can achieve very good signal transmission function in the THz frequency band. TSV provides vertical electrical connections with low loss and, therefore, has been extensively investigated and developed [9,10,11,12,13,14,15,16,17,18,19 The proposed filter is designed using odd-even mode analysis and coupling coefficient theory as described in Section 2. The results of the S-parameters and a performance comparison of relative THz bandpass filters are presented in Section 3.…”

Section: Introductionmentioning

confidence: 99%

TSV-based hairpin bandpass filter for 6G mobile communication applications

Wang

Yin

et al. 2021

IEICE Electron. Express

View full text Add to dashboard Cite

Aimed at sixth-generation (6G) mobile communication applications, three fifth-order novel ultra-compact hairpin bandpass filter is proposed. Through-Silicon Via (TSV), a three-dimensional integration technology, is used to implement the arms of hairpin units, and some hairpin units consist of four arms. In this letter, the design method of the three proposed filters is introduced, and the filtering characteristics are verified by HFSS, an industry-grade simulator based on finite element method. The results reveal that the three proposed filter has the center frequency of 0.405 THz, 0.3915 THz, and 0.3955 THz with bandwidth of 0.1 THz, 0.077 THz, and 0.063 THz and exhibits an insertion loss of 2.0 dB and return loss over 12.4 dB, 13.4 dB, and 14 dB. The size of the three proposed filters is both 0.284 × 0.0325 mm 2 (1.29 × 0.148λ g 2 ).

show abstract

“…3-D packaging technology using through-silicon vias (TSVs) initiates the realization of passive components including on-chip inductor, capacitor, filters, and so on [2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19]. Compared with a conventional 2-D inductor, a TSV-based 3-D inductor has advantages of high inductance density and less form factor [20][21][22][23][24]. There are some researches focusing on the modeling of the DC inductance of TSV-based inductor.…”

Section: Introductionmentioning

confidence: 99%

Analytical models of AC inductance and quality factor for TSV-based inductor

Yin

Wang

2021

IEICE Electron. Express

View full text Add to dashboard Cite

Aimed at the emerging on-chip three-dimensional throughsilicon vias (TSVs)-based inductor, the formula for the DC inductance is proposed. And then, based on this formula and the equivalent circuit model analytical models of AC inductance and quality factor are proposed considering frequency effect. Finally, the TSV-based inductors are fabricated and measured. It is shown that the reported results match very well with each other.

show abstract

Investigating on Through Glass via Based RF Passives for 3-D Integration

Cited by 33 publications

References 16 publications

Wireless communication and wireless power transfer system for implantable medical device

Wireless communication and wireless power transfer system for implantable medical device

TSV-based hairpin bandpass filter for 6G mobile communication applications

Analytical models of AC inductance and quality factor for TSV-based inductor

Contact Info

Product

Resources

About