2005
DOI: 10.1557/proc-867-w7.9
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Investigating the Effects of Diluting Solutions and Trace Metal Contamination on Aggregation Characteristics of Silica-Based ILD CMP Slurries

Abstract: One of the major drawbacks to CMP is the tendency for abrasive particles in slurries to form aggregates, which have the potential to cause defects on wafer surfaces. Therefore, it is crucial to understand the mechanisms by which aggregates are formed so appropriate metrology can be implemented that will identify defect-causing slurries before they are used in the fab. Single particle optical sensing (SPOS) techniques are commonly used to obtain large particle counts (LPC) for slurries. The SPOS technique requi… Show more

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Cited by 5 publications
(2 citation statements)
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“…1 The need of continuous, non-invasive, in-line monitoring of powder suspensions in fluids is increasing, in connection with the rapid development of materials and devices through the bottom-up approach [2][3][4][5][6][7][8] as well as the need of characterizing small particles in the traditional topdown processes. [9][10][11][12][13][14][15] Quite recently, attention has been given to the possibility of driving the interactions through specific shapes of the building blocks to be assembled, [16][17][18][19] thus mimicking the behavior of atoms and molecules with chemical bonds. Over the last decades, very powerful techniques for the characterization of small particles became available.…”
Section: Introductionmentioning
confidence: 99%
“…1 The need of continuous, non-invasive, in-line monitoring of powder suspensions in fluids is increasing, in connection with the rapid development of materials and devices through the bottom-up approach [2][3][4][5][6][7][8] as well as the need of characterizing small particles in the traditional topdown processes. [9][10][11][12][13][14][15] Quite recently, attention has been given to the possibility of driving the interactions through specific shapes of the building blocks to be assembled, [16][17][18][19] thus mimicking the behavior of atoms and molecules with chemical bonds. Over the last decades, very powerful techniques for the characterization of small particles became available.…”
Section: Introductionmentioning
confidence: 99%
“…Basically, industry needs to guarantee both the stability of PSD and concentration upon time to prevent the surfaces from scratches and to accurately control the removal rates (Nicholes et al 2003;Remsenz et al 2006). Among the possible issues, the formation of aggregates and the contamination by other materials (metals, chemicals) are common (DeNardis et al 2005;Li 2008). Also, the presence of nano-and micro-bubbles is possible.…”
Section: Introductionmentioning
confidence: 99%