Investigating the effects of Silicon etching imperfections on the quadrature error in MEMS gyroscopes

Azier, Alexandre; Leverrier, B.; Kacem, Najib; Chaumet, B.; Bouhaddi, Noureddine

doi:10.1109/inertial53425.2022.9787765

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2024

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“…The width dispersion of drive beams caused by the fabrication imperfections is the major source of the mechanical quadrature [2]. Currently, the dispersion has decreased to less than 10 nm, which can lead to quadrature of about hundreds degree per second [2], [3]. The non-ideality of beam width is caused by the etching error during the wafer processing.…”

Section: Introductionmentioning

confidence: 99%

Wafer-level identification of the beam width of MEMS gyroscopes

Xu,

Lin,

et al. 2024

Ninth International Symposium on Sensors, Mechatronics, and Automation System (ISSMAS 2023)

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This paper proposed an in-situ electrical method that can identify the drive beam width and the sense beam width of the MEMS gyroscope at the wafer level. The mechanical frequencies of two special modes were selected to characterize the beam width. Ten chips distributed on a wafer was selected for experiments. The experimental results indicate that the etching error increasing from the wafer center to the edge, and the dispersion on a wafer with a radius of 75 mm is about 300 nm. Optical microscopy was used to prove the reliability of the method and the wafer-level data verified the distribution of the etching error. This work is aimed at providing a method for fabless designers to explore the fabrication imperfections during the MEMS wafer processing.

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Section: Introductionmentioning

confidence: 99%