Investigating the movement of chip components during reflow soldering

Krammer, Olivér; Radvánszki, Zoltán; Illyefalvi‐Vitéz, Zsolt

doi:10.1109/estc.2008.4684463

Cited by 5 publications

(2 citation statements)

References 9 publications

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“…However, this approach could only show movement in the lateral direction. In [16], an advanced model that considers different forces, including hydrostatic and capillary pressure, gravity, dynamic friction, and surface tension, was developed. The model simulated how the components moved in length and width directions.…”

Section: Related Workmentioning

confidence: 99%

A pick-and-place process control based on the bootstrapping method for quality enhancement in surface mount technology

Kim,

Zhang,

Won

et al. 2024

Int J Adv Manuf Technol

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Surface Mount Technology (SMT) is a technique in electronic manufacturing to assemble electronic components on the surface of printed circuit boards. The industry has faced new challenges because of the increasing complexity of the assembly process to satisfy requirements such as lightweight, smaller size, and diverse configurations. With the usage of lead-free solder and the trend toward miniaturization in the electronics industry, the misalignment of solder paste has become more problematic. As the size of components decreases, it becomes more challenging to guarantee accurate placement and alignment during the assembly process. Self-alignment is a physical phenomenon during soldering, where components attached to soldered pads experience movement. Self-alignment can enhance the assembly quality by adjusting component positions near the desired position. However, it can lead to assembly defects, such as poor attachment and tombstoning, as components are shifted away from the pad center, resulting in an unbalanced position. Therefore, understanding and correctly using self-alignment becomes significant in modern electronic manufacturing. This research proposes a model that collects data from inspection to estimate the self-alignment strength and find a new placement location that can reduce component misalignment and enhance dimensional requirements for PCB assembly, such as side overhang and end overlap.

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Section: Related Workmentioning

confidence: 99%

A pick-and-place process control based on the bootstrapping method for quality enhancement in surface mount technology

Kim,

Zhang,

Won

et al. 2024

Int J Adv Manuf Technol

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show abstract

“…As consequence, five types of identical PCBs were used from pad finishes, component and solder paste deposit volume points of view, for a minimum of three different thermal profile for each of the soldering process (VPS & IR/C) [11], [12].…”

Section: The Process Influencesmentioning

confidence: 99%

HISOLD 4P Q&R, COST project for solder material innovations and solder joint properties assessment

Plotog

Svasta

Villain

et al. 2009

2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME)

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The solder joints properties are in connection with their microstructure, which is the result ofthe soldering Process temperature gradient action over the trinomial solder alloy/Paste, electronic components terminals/Pin and PCBs Pads characteristics (4P Soldering Model). The temperature gradient will be determinate by the specific thermal profile ofthe soldering process. As part of COST Action MP0602, Working Group 2 (The properties of solder joints), the HISOLD 4P-Q&R Group project will investigate, into integrated approach, the properties ofsolder joints realized by different Paste-Pad-Pin-Process reflow soldering formulas, with focus on innovative lead-free solder alloys, including composite type with nanoparticles content. The 4P Soldering Model concept and the project proposed investigations are based on numerous experiments and macro/microstructural analyzes including optical and X-Ray inspections, Surface Acoustic Microscopy (SAM), Scanning Electron Microscopy (SEM), nanoindentation and Electron Backscattering Diffraction (EBSD), before and after electrical, mechanical and climatic tests. Proposals for solder joints functionality standard test methods, test vehicles and data bases will be elaborated as result of environmental stress studies, thermodynamical, rheological and macro/microstructural solder joints analyses, based on fPC references. A standard SAC solder alloy and the reflow soldering process will be used as reference. As a consequence, the DFM concept can be improved with practical manufacturing requirements.

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A Physics-Informed Machine Learning Model for Mounting Optimization in Printed Circuit Boards

Kim,

Farrag,

Cao

et al. 2024

Lecture Notes in Mechanical Engineering

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Investigating the movement of chip components during reflow soldering

Cited by 5 publications

References 9 publications

A pick-and-place process control based on the bootstrapping method for quality enhancement in surface mount technology

A pick-and-place process control based on the bootstrapping method for quality enhancement in surface mount technology

HISOLD 4P Q&R, COST project for solder material innovations and solder joint properties assessment

A Physics-Informed Machine Learning Model for Mounting Optimization in Printed Circuit Boards

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Investigating the movement of chip components during reflow soldering

Cited by 5 publications

References 9 publications

A pick-and-place process control based on the bootstrapping method for quality enhancement in surface mount technology

A pick-and-place process control based on the bootstrapping method for quality enhancement in surface mount technology

HISOLD 4P Q&#x00026;R, COST project for solder material innovations and solder joint properties assessment

A Physics-Informed Machine Learning Model for Mounting Optimization in Printed Circuit Boards

Contact Info

Product

Resources

About

HISOLD 4P Q&R, COST project for solder material innovations and solder joint properties assessment