2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) 2013
DOI: 10.1109/eptc.2013.6745773
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Investigating the temperature effect of reliability on integration IC 3D packaging under drop test

Hao-Chih Chen
1
,
Yi-Che Chiang
2
,
Tuan‐Yu Hung
3
et al.
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