Investigation and Optimization of a Cooling System Prototype for a Module of the Silicon Tracking System for the BM@N Experiment

Abstract

Various materials were tested for use in the elements of the cooling system for the readout electronics of the BM@N silicon tracking detector. The thermal design was performed using the ANSYS software package and the thermal conductivities of various adhesives and carbon-fiber composites were experimentally measured. The results were used to select materials for cooling fins. Thermal tests of the prototypes of front-end-board boxes have been carried out, during which various thermal interfaces were also tested.

Thermal design of focal plane assembly of wavefront camera for exoplanet imaging corona module

“…The EMCCD has a one-stage thermoelectric cooler encapsulated on the bottom side of the interior with a maximum cooling temperature difference of 50℃. In order to ensure the cooling effect and reduce heat leakage, the CCD adopts Kovar alloy as the packaging material, and its thermal conductivity is as low as 15.5 17W / m K −  [10] . In order to reduce its radiation heat leakage, its inner and outer surfaces are gold-plated.…”