Microelectronics Reliability
 2022
DOI: 10.1016/j.microrel.2022.114488
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Investigation into thermo-mechanical reliability of copper trace lines in stacked dies ball grid array packaging

Meng-Kai Shih
1
,
Sean Shih
2
,
Tse-Wei Liao
3
et al.
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Cited by 7 publications
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