2014 IEEE 64th Electronic Components and Technology Conference (ECTC) 2014
DOI: 10.1109/ectc.2014.6897354
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Investigation of a TSV-RDL in-line fault-diagnosis system and test methodology for wafer-level commercial production

Runiu Fang
1
,
Min Miao
2
,
Xiankai Sun
3
et al.
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Cited by 2 publications
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High frequency analysis and characterization of TSVs for high-speed integrated systems

Miao
1
,
Fang
2
,
Sun
3
et al. 2016
2016 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-A
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High frequency analysis and characterization of TSVs for high-speed integrated systems

Miao
1
,
Fang
2
,
Sun
3
et al. 2016
2016 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-A
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Inspection and classification of redistribution layer based on principal component analysis of high dimensional ultrasound signal

Kim,
Su Kim,
Kim
et al. 2024
2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS)
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