Investigation of Analytical Solutions for Bonded Structures by Photomechanical Methods

Abstract

In this paper, both photoelasticity and moiré interferometry were successively incorporated with finite element method to investigate the predicted thermal stresses and lateral displacement of bonded structures calculated from different theories. It was found that the distributions of moment and transverse force play significant roles in making different values of thermal stresses in the adherends by authors’ and Suhir's 1986 theories. On the other hand, the values of lateral displacement obtained from different theories are almost identical.

Transient thermal stress intensity factors of bimaterial interface cracks using refined three-fringe photoelasticity

“…Bimaterial strips are the simplified models used in the literature for experimental and theoretical analysis of electronic packages and bimetal thermostats [1]. Photoelasticity [1][2][3] and moiré interferometry [4,5] have been used to analyse the steady state thermal stresses in bimaterial strips. During thermal cycling of bimaterial specimens, the induced thermal stresses are predominant near the edges of the interface, which may eventually cause fatigue failure by initiating interface edge cracks [6].…”