Investigation of buckling transition from straight-sided to telephone-cord wrinkles in Al films

Jia, Hanxiang; Wang, Shibin; Goudeau, P.; Li, Linan; Xue, Xiuli

doi:10.1088/0960-1317/23/4/045014

Cited by 16 publications

(12 citation statements)

References 24 publications

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“…Our nonlinear simulations of the telephone cord buckles show that the minimum energy with respect to λ/b is very shallow as the value of σ 0 /σ E increases. The results reported here demonstrate that the interface sliding leads to a noticeable wavelength dependent minimum energy state, which maybe is the reason for the wavelength variation in the telephone cord buckle observed in experiments [18,27].…”

Section: Discussionsupporting

confidence: 56%

“…The wavelength variation in the telephone cord buckles has widely been reported in experiments [18,27]. Moon et al [18] found that there is no measured value of λ/b smaller than 1.9 and the fraction of the value of λ/b above 1.9 is as much 40%.…”

Section: Discussionmentioning

confidence: 89%

“…Moon et al [18] experimentally found that some wavelengths of the telephone cord buckles in diamond-like-carbon films deposited on silicon substrates are much larger than that of the predictions. Jia et al [27] reported that the ratio between the wavelength and the half-width of the telephone cord buckle in aluminum films on polymethylmethacrylate substrates is not constant and increases with the increase in the half-width of the straight-sided blister. Recently, Faou et al [21] demonstrated that interface adhesion plays a key role in the formation of telephone cord buckles.…”

Section: Introductionmentioning

confidence: 99%

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Effects of interface sliding on the formation of telephone cord buckles

Pan

2013

Phys. Rev. E

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Sliding at interface during thin film buckling was reported by recent atomistic simulations. A stability analysis under the Föppl-von Kármán plate theory is performed to investigate the effect of interface sliding on the transition of a straight-sided blister to the telephone cord buckle in biaxially compressed thin films on rigid substrates. It is shown that the critical stress and the wavelength of the telephone cord buckle significantly increase as the interface sliding is noticeable in comparison with the constant values derived from previous classic analysis without interface sliding. Our theoretic analysis is further validated by results from numerical simulations based on our recently developed continuum model of nonlinear buckling. The results indicate that the wavelength variation in the telephone cord buckle observed in experiments may be due to interface sliding.

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Section: Discussionsupporting

confidence: 56%

Section: Discussionmentioning

confidence: 89%

Section: Introductionmentioning

confidence: 99%

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Effects of interface sliding on the formation of telephone cord buckles

Pan

2013

Phys. Rev. E

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“…Recently, buckling has attracted much attention as a useful approach for surface pattern controlment and material property characterization, which arises when a relatively thick substrate‐supported thin layer undergoes an excessive compression. The compression generally originates from the mechanical constants mismatch between different layers, which can be utilized to create interesting topographical patterns such as straight‐sided wrinkles, telephone cord structures, and circular blisters . A range of different strategies have been explored to produce patterns in thin films.…”

Section: Introductionmentioning

confidence: 99%

Solvent‐induced surface instability of thin metal films on a polymer substrate

Xue

Wang

Zeng

et al. 2017

Surface & Interface Analysis

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The solvent-provoked formation and evolution of thin film buckling-delamination on a compliant substrate have been studied. The film surface is observed by an optical microscope showing a remarkable dynamic buckling-delamination development and a subsequent stable branchedstraight state. It is revealed that the initiation, propagation, and the resulting patterns of film buckles are strongly dependent on the solvent type, film stress, interfacial adhesion, and film thickness. The buckling could be controlled further by a reasonable chemical solvent configuration and used to provide useful information for the pattern creation on polymer systems in diverse fields, such as micro/nanofabrication and optics. KEYWORDS buckle, film stress, polymer substrate, solvent diffusion, thin film 1 | INTRODUCTION Thin films and coatings are widely used in a substantial range of technological applications, ranging from protective layers to applications in optical, electric, engineering, biomedical, nuclear, and thermal fields. The high performance and reliability of film-substrate structures are strongly dependent on their mechanical integrity and the adhesion to the substrate. Failure of thin film coatings can occur in various forms, such as blistering, delamination, and dewetting.Surface instability is ubiquitous which can be frequently observed in many systems, involving metallic or soft polymeric thin films on elastomeric substrates, hydrogels on a rigid flat substrate, and biological tissues in response to external stimuli, such as mechanical pressure, 1,2 temperature, 3 pH level, 4 light, 5 humidity, 6 and solvent environment. 7 Although the phenomenon has been treated as a nuisance to be avoided, researchers have extensively exploited the surface instability in a wide range of applications ranging from microelectronics, 8,9 biotechnology, 10 fabrication of structures 11 to optical systems 12,13 and microfluidic devices. 14,15 Recently, buckling has attracted much attention as a useful approach for surface pattern controlment and material property characterization, 16,17 which arises when a relatively thick substrate-supported thin layer undergoes an excessive compression. The compression generally originates from the mechanical constants mismatch between different layers, which can be utilized to create interesting topographical patterns such as straight-sided wrinkles, 18 telephone cord structures, 19-23 and circular blisters. 24,25 A range of different strategies have been explored to produce patterns in thin films. Laser-induced well-ordered and controllable telephone cord patterns were constructed in as-deposited metallic thin films. 26 Pre-patterning the thin film under strain, in combination with a triggered release of the adhesion via electrochemistry, allowed for the design of well-controlled sub-micrometer. 27 Formation of mutually orthogonal multi-scale instability modes was triggered by electric-thermal loads. 28 A freely floating polymer film wrinkled under the capillary force exerted by a drop of water. 29 It is...

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“…Thin film buckling studies are generally started with eigenvalue buckling estimates. In our work, imperfections based on the random combination of buckling eigenmodes are introduced in the FEM analyses to take into account the film buckling [31]. The next step of a typical buckling analysis is to perform a nonlinear calculation of large deformation analysis, and finally to investigate the patterns of buckled films which are caused by initial geometric imperfections.…”

Section: Imperfectionsmentioning

confidence: 99%

Stress Relaxation Related to Spontaneous Thin Film Buckling: Correlation between Finite Element Calculations and Micro Diffraction Analysis

Jia

Wang

Tamura

et al. 2018

QuBS

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Compressive residual stresses generated during thin film deposition may lead to undesirable film damage, such as delamination, buckling, and flaking, ultimately leading to the failure of the device employing the film. Understanding the residual stress generation and role in these damage mechanisms is necessary to preserve thin film integrity and optimize its functional properties. Thin shell theory has been used for decades to predict buckling but the results have not yet been correlated with experimental data since the techniques used to measure stress in metallic films were not able to do so at the required micron scale until recently. Micro scanning X-ray diffraction now enables the direct mapping of the local stress of metallic films. In this paper, finite element method based on thin shell theory and synchrotron X-ray micro diffraction have been used to determine stress maps of thin film buckling patterns. Calculations of the stress distribution in the metallic films have been performed taking into account the buckling geometry determined from optical measurements. Stress distributions over gold blisters and tungsten wrinkles obtained with the two techniques are in fair agreement and allow for the accurate determination of the stress relaxation profile from the bottom to the top of the buckling, validating the thin shell theory model.

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Investigation of buckling transition from straight-sided to telephone-cord wrinkles in Al films

Cited by 16 publications

References 24 publications

Effects of interface sliding on the formation of telephone cord buckles

Effects of interface sliding on the formation of telephone cord buckles

Solvent‐induced surface instability of thin metal films on a polymer substrate

Stress Relaxation Related to Spontaneous Thin Film Buckling: Correlation between Finite Element Calculations and Micro Diffraction Analysis

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